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参数资料
| 型号： | HMC599ST89 |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 放大器 |
| 英文描述： | 50 MHz - 960 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | PLASTIC, SOT-89, SMT, 3 PIN |
| 文件页数： | 6/8页 |
| 文件大小： | 735K |
| 代理商： | HMC599ST89 |
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
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7 - 6
HMC599ST89 / 599ST89E
v02.0311
GaAs pHEMT MMIC LNA, 75 Ohm
50 - 1000 MHz
Outline Drawing
Absolute Maximum Ratings
Drain Bias Voltage (Vdd)
+6 Vdc
rf input power (rfiN)
+10 dBm
Channel Temperature
175 °C
Continuous pdiss (T = 85 °C)
(derate 9.84 mw/°C above 85 °C)
0.89 w
Thermal resistance
(junction to ground paddle)
101.67 °C/w
storage Temperature
-65 to +150 °C
operating Temperature
-40 to +85 °C
part Number
package Body material
lead finish
msl rating
package marking [3]
HmC599sT89
low stress injection molded plastic
sn/pb solder
msl1
[1]
H599
XXXX
HmC599sT89e
roHs-compliant low stress injection molded plastic
100% matte sn
msl1
[2]
H599
XXXX
[1] max peak reflow temperature of 235 °C
[2] max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Typical Supply Current vs. Vdd
Vdd (Vdc)
idd (mA)
+5
120
+3
120
NoTes:
1. PACKAGE BODY MATERIAL:
MOLDING COMPOUND MP-180S OR EQUIVALENT.
2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING.
3. LEAD PLATING: 100% MATTE TIN.
4. DIMENSIONS ARE IN INCHES [MILLIMETERS]
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15 mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25 mm PER SIDE.
7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
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