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参数资料
| 型号： | HT2MOA3S20 |
| 厂商： | NXP Semiconductors N.V. |
| 英文描述： | HITAGTM2 Chip Module |
| 中文描述： | HITAGTM2芯片模块 |
| 文件页数： | 2/22页 |
| 文件大小： | 161K |
| 代理商： | HT2MOA3S20 |
Specifications of the HT2 MOA3 S20
Rev. 1.1
1997-08-19
Ht2moa3.doc/HS
Page 2 of 22
Table of Contents
1 Definitions..............................................................................................................................3
1.1 Objective of the Specifications.....................................................................................................................3
1.2 Definition of the Chip Module.....................................................................................................................3
1.3 Use of the Modules......................................................................................................................................3
2 Specifications .........................................................................................................................4
2.1 Mechanical Properties .................................................................................................................................4
2.2 Materials.....................................................................................................................................................4
2.3 Temperature Range .....................................................................................................................................4
2.4 Storage Conditions ......................................................................................................................................5
2.5 Delivery Conditions.....................................................................................................................................5
2.6 Electrical Specifications...............................................................................................................................6
3 Drawing of the Chip Module HT2 MOA3 S20.....................................................................7
3.1 Drawing of the Reel.....................................................................................................................................7
3.2 Module outline suggestion...........................................................................................................................8
3.3 Splicing Specification..................................................................................................................................9
4 Coil Specifications................................................................................................................ 10
5 Functional Description of HITAG 2 ................................................................................... 12
5.1 Memory Organization................................................................................................................................ 12
5.2 Operation Modes and Configuration.......................................................................................................... 13
5.2.1 Modes of Operation............................................................................................................................ 13
5.2.2 Status Flow ........................................................................................................................................ 14
5.2.3 Configuration..................................................................................................................................... 15
5.3 Configuration of Delivered HITAG 2 Transponders................................................................................... 16
5.4 Definition of Passwords and Keys.............................................................................................................. 17
6 Quality Inspection ............................................................................................................... 18
7 Characterisation and Test of the Final Transponder......................................................... 19
7.1 Characterisation of the Transponder.......................................................................................................... 19
7.2 Final Test of the Transponder.................................................................................................................... 19
8 Ordering Information.......................................................................................................... 20
HITAG
TM
is a trademark of Philips Electronics N.V.
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相关代理商/技术参数 |
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|---|---|
| HT2MOA3S20/E/1 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:HITAGTM2 Chip Module |
| HT2MOA3S20/E/3 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:HITAGTM2 Chip Module |
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