- 您现在的位置：买卖IC网 > PDF目录367253 > HT2MOA3S20 (NXP Semiconductors N.V.) HITAGTM2 Chip Module PDF资料下载
参数资料
| 型号： | HT2MOA3S20 |
| 厂商： | NXP Semiconductors N.V. |
| 英文描述： | HITAGTM2 Chip Module |
| 中文描述： | HITAGTM2芯片模块 |
| 文件页数： | 21/22页 |
| 文件大小： | 161K |
| 代理商： | HT2MOA3S20 |
Specifications of the HT2 MOA3 S20
Rev. 1.1
1997-08-19
Ht2moa3.doc /HS
Page 21 of 22
Definitions
Data sheet status
Objective specification
This data sheet conta ins target or goal specifications for product deve lopment.
Preliminary specification This data sheet conta ins preliminary data; supp lementary data may be
published later.
Product spec ification
This data sheet conta ins final product spec ifications.
Limiting values
Limiting values given are in acco rdance with the Abso lute Maximum Rating Syste m (IEC 134).
Stress above one o r more of the limiting values may cause pe rmanent da mage to the dev ice.
These are stress ratings on ly and ope ration of the device at these o r at any othe r cond itions
above those g iven in the Characteristics sect ion of the spec ification is not implied. Exposu re to
limiting values for extended pe riods may affect device reliab
ility.
Application information
Where application information is given, it is advisory and does not form part of the spec ification.
Life support applications
These products are not designed for use in life support appliances, devices, or systems where
malfunction of these products can reasonably be expected to result in personal injury. Philips
Semiconductors′ customers using or selling these products for use in such applications do so on
their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from
such improper use or sale.
相关PDF资料 |
PDF描述 |
|---|---|
| HT7704A | TOUCH CONTROL CIRCUIT|CMOS|DIP|8PIN |
| HT7703 | TOUCH CONTROL CIRCUIT|CMOS|DIP|14PIN |
| HT7704B | TOUCH CONTROL CIRCUIT|CMOS|DIP|8PIN |
| HT7704C | TOUCH CONTROL CIRCUIT|CMOS|DIP|8PIN |
| HT7712B | Industrial Control IC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HT2MOA3S20/E/1 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:HITAGTM2 Chip Module |
| HT2MOA3S20/E/3 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:HITAGTM2 Chip Module |
| HT2-ORN | 功能描述:胶带 Hazard Tape, Adhesive, 2" x 60Yd, Orange RoHS:否 制造商:3M Electronic Specialty 产品:Tapes 类型:Shielding 描述/功能:EMI/RFI Foil Shielding Tape 颜色: 材料:Copper Foil 宽度:1 in x 18 yds |
| HT2P-BLK-WHT | 制造商:Panduit Corp 功能描述: |
| HT2R2M2AB-0513(E) | 制造商:SPC Multicomp 功能描述:CAPACITOR 2.2UF 100V |
发布紧急采购，3分钟左右您将得到回复。