参数资料
型号: HYS72D64020GR-7-X
厂商: INFINEON TECHNOLOGIES AG
元件分类: DRAM
英文描述: 64M X 72 DDR DRAM MODULE, 0.75 ns, DMA184
封装: DIMM-184
文件页数: 3/23页
文件大小: 277K
代理商: HYS72D64020GR-7-X
HYS 72Dxx0x0GR
Registered DDR-I SDRAM-Modules
INFINEON Technologies
11
2.01
AC Characteristics (for reference only)
(values apply to the SDRAM component and do not include register, PLL, or card wiring)
(
T
A =0 to +70 °C, VDD =2.5 V±0.2 V)
Parameter
Symbol
-7
DDR266A
-7.5
DDR266B
-8
DDR200
Unit
Notes
min.
max.
min.
max.
min.
max.
DQ Output Access Time from CK/CK
t
AC
– 0.75
+ 0.75
– 0.75
+ 0.75
– 0.8
+ 0.8
ns
DQS Output access Time from CK/CK
t
DQSCK
– 0.75
+ 0.75
– 0.75
+ 0.75
– 0.8
+ 0.8
ns
CLK High Level Width
t
CH
0.45
0.55
0.45
0.55
0.45
0.55
tCK
CLK Low Level Width
t
CL
0.45
0.55
0.45
0.55
0.45
0.55
tCK
Clock Period
CL = 2
t
CK
7.5
1210
12
1012ns
1)
CL = 2.5
712
7.5
12
812
ns
DQ and DM Input Hold Time
t
DH
0.5
0.5
0.6
ns
DQ and DM Input Setup Time
t
DS
0.5
0.5
0.6
ns
DQ and DM Input Pulse Width
(for each input)
t
DIPW
1.75
1.75
2
ns
Data-Out High-impedance from CK/CK
t
HZ
– 0.75
+ 0.75
– 0.75
+ 0.75
– 0.8
+ 0.8
ns
Data-Out Low-impedance from CK/CK
t
LZ
– 0.75
+ 0.75
– 0.75
+ 0.75
– 0.8
+ 0.8
ns
Write Command to First DQS Latching
Transition
t
DQSS
0.75
1.25
0.75
1.25
0.75
1.25
t
CK
DQS-DQ Skew
t
DQSQ
+0.5
+0.5
+0.6
ns
QH Data-Out Hold Time from DQS
t
QH
tHP-
0.75
tHP-
0.75
tHP-1.0 –
ns
2)
DQS input low (high) pulse width
(write cycle)
t
DQSL;H
0.35
0.35
0.35
t
CK
DQS falling edge to CK setup time
(write cycle)
t
DSS
0.2
0.2
0.2
t
CK
DQS falling edge hold time from CK
(write cycle)
t
DSH
0.2
0.2
0.2
t
CK
Mode register set command cycle time
t
MRD
14
15
16
ns
Write Preamble Setup Time
t
WPRES
0
0
0
ns
Write Postamble
t
WPST
0.40.6
0.4
0.6
t
CK
Write Preamble
t
WPRE
0.25
0.25
0.25
t
CK
Address and control input setup time
t
IS
0.9
0.9
1.2
ns
3)
Address and control input hold time
t
IH
0.9
0.9
1.2
ns
3)
Read Preamble
t
RPRE
0.91.1
0.9
1.1
t
CK
Read Postamble
t
RPST
0.40.6
0.4
0.6
t
CK
Row Active Time
t
RAS
45
120K
45
120k
50
120K
ns
Row Cycle Time
R/W Operation
t
RC
65
65
70
ns
Auto Refresh
t
RFC
75
75
80
ns
1)
RAS to CAS Delay
t
RCD
20
20
20
ns
Row Precharge Time
t
RP
20
20
20
ns
Active bank A to Active bank B command
t
RRD
15
15
15
ns
Write Recovery Time
t
WR
15
15
15
ns
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