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| 型号： | IBM25PPC750FX-DB0122T |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 600 MHz, RISC PROCESSOR, CBGA292 |
| 封装： | 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292 |
| 文件页数： | 36/62页 |
| 文件大小： | 452K |
| 代理商： | IBM25PPC750FX-DB0122T |
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DD 2.X
Preliminary
PowerPC 750FX RISC Microprocessor
Body_750FX_DS_DD2.X.fm.2.0
June 9, 2003
5. System Design Information
Page 39 of 63
5.3 Decoupling Recommendations
Capacitor decoupling is required for the 750FX. Decoupling capacitors act to reduce high frequency chip
switching noise and provide localized bulk charge storage to reduce major power surge effects.
High frequency decoupling capacitors should be located as close as possible to the processor with low lead
inductance to the ground and voltage planes.
Decoupling capacitors are recommended on the back of the card, directly opposite the module. The recom-
mended placement and number of decoupling capacitors, 34 VDD-GND caps and 44 OVDD-GND caps are
described in Figure 5-4 Orientation and Layout of the 750FX Decoupling Capacitors. The recommended
decoupling capacitor specifications are provided in Table 5-4 Recommended Decoupling Capacitor Specifi-
cations. The placement and usage described here are guidelines for decoupling capacitors and should be
applied for system designs.
The decoupling capacitor electrodes are located directly opposite from their corresponding BGA pins where
possible. Also, each electrode for each decoupling capacitor needs to be connected to one or more BGA pins
(balls) with a short electrical path. Thus, through-vias adjacent to the decoupling capacitors
are recommended.
The card designer can expand on the decoupling capacitor recommendations by doing the following:
Adding additional decoupling capacitors
If using additional decoupling capacitors, verify that these additional capacitors do not reduce the number
of card vias or cause the vias to lose proximity to each capacitor electrode.
Adding additional through-vias or blind-vias
Card technologies are available that will reduce the inductance between the decoupling capacitor and the
BGA pin (ball). Replacing single vias with multiple vias is very effective. Place GND vias close to VDD or
OVDD vias to reduce loop inductance.
For more information on power layout and bypassing, see the IBM Application Note, “PowerPC 750FX Layout
and Bypassing.
Table 5-4. Recommended Decoupling Capacitor Specications
Item
Description
Decoupling capacitor specications:
Type X5R or Y5V
10V minimum
0402 size
40 x 20 mils, nominally
1.0 mm x 0.5 mm 0.1 mm on both dimensions
100 nF
Recommended minimum number of decou-
pling capacitors on the back of the card:
34 VDD-GND caps
44 OVDD-GND caps
相关PDF资料 |
PDF描述 |
|---|---|
| IBM25PPC750FX-DB1013T | 32-BIT, 733 MHz, RISC PROCESSOR, CBGA292 |
| IBM25PPC750FX-GB0112T | 32-BIT, 600 MHz, RISC PROCESSOR, CBGA292 |
| IBM25PPC750FX-DB0513T | 32-BIT, 700 MHz, RISC PROCESSOR, CBGA292 |
| IBM25PPC750FX-FB0533T | 32-BIT, 700 MHz, RISC PROCESSOR, CBGA292 |
| IBM25PPC750FX-FB0112T | 32-BIT, 600 MHz, RISC PROCESSOR, CBGA292 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IBM25PPC750FX-FB1013T | 制造商:IBM 功能描述:32-BIT, 733 MHZ, RISC PROCESSOR, CBGA292 |
| IBM25PPC750FX-FB2513T | 制造商:IBM 功能描述:32-BIT, 800 MHz, RISC PROCESSOR, CBGA292 |
| IBM25PPC750FX-GB0122V | 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays |
| IBM25PPC750FX-GB0132T | 制造商:IC'S/TRANSISTORS/DIO 功能描述: 制造商:IC'S/TRANSISTORS/DIODES 功能描述: |
| IBM25PPC750FX-GB0132V | 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays |
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