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| 型号： | IBM25PPC750FX-DB0513T |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 700 MHz, RISC PROCESSOR, CBGA292 |
| 封装： | 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292 |
| 文件页数： | 52/62页 |
| 文件大小： | 452K |
| 代理商： | IBM25PPC750FX-DB0513T |
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DD 2.X
PowerPC 750FX RISC Microprocessor
Preliminary
5. System Design Information
Page 54 of 63
Body_750FX_DS_DD2.X.fm.2.0
June 9, 2003
5.8.4 Heat Sink Mounting
5.8.5 Thermal Assist Unit
The thermal sensor in the Thermal Assist Unit (TAU) has not been characterized to determine the basic
uncalibrated accuracy. The relationship between the actual junction temperature and the temperature indi-
cated by THRM1 and THRM2 is not well known.
IBM recommends that the TAU in these devices be calibrated before use. Calibration methods are discussed
in the IBM Application Note Calibrating the Thermal Assist Unit in the IBM25PPC750L Processors.
Although this note was written for the 750L, the calibration methods discussed in this document also apply to
the 750FX.
In rare cases, the basic error of the TAU may be so large that a useful calibration cannot be achieved.
Figure 5-10. Package Exploded Cross-Sectional View with Several Heat Sink Options
Table 5-8. Maximum Heatsink Weight Limit for the CBGA
Force
Maximum
Maximum dynamic compressive force allowed on the BGA balls
42.9 N
Maximum dynamic tensile force allowed on the BGA balls
9.05 N
Maximum dynamic compressive force allowed on the chip
14.8 N
Maximum mass of module + heatsink when heatsink is not bolted to card
50g
CBGA Package
Heat Sink
Heat Sink clip
Adhesive
or
Thermal
Interface
Material
Printed
Option
Circuit
Board
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相关代理商/技术参数 |
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|---|---|
| IBM25PPC750FX-FB1013T | 制造商:IBM 功能描述:32-BIT, 733 MHZ, RISC PROCESSOR, CBGA292 |
| IBM25PPC750FX-FB2513T | 制造商:IBM 功能描述:32-BIT, 800 MHz, RISC PROCESSOR, CBGA292 |
| IBM25PPC750FX-GB0122V | 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays |
| IBM25PPC750FX-GB0132T | 制造商:IC'S/TRANSISTORS/DIO 功能描述: 制造商:IC'S/TRANSISTORS/DIODES 功能描述: |
| IBM25PPC750FX-GB0132V | 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays |
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