参数资料
型号: IBM25PPC750FX-GB0112T
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 600 MHz, RISC PROCESSOR, CBGA292
封装: 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
文件页数: 39/62页
文件大小: 452K
代理商: IBM25PPC750FX-GB0112T
DD 2.X
PowerPC 750FX RISC Microprocessor
Preliminary
5. System Design Information
Page 42 of 63
Body_750FX_DS_DD2.X.fm.2.0
June 9, 2003
5.4 Output Buffer DC Impedance
The 750FX 60x drivers were characterized over various process, voltage, and temperature conditions. To
measure Z0, an external resistor is connected to the chip pad, either to OVDD or GND. Then the value of such
resistor is varied until the pad voltage is OVDD/2 (see Figure 5-6).
The output impedance is actually the average of two resistances: the resistance of the pull-up and the resis-
tance of pull-down devices. When Data is held low, SW1 is closed (SW2 is open), and RN is trimmed until
Pad=OVDD/2. RN then becomes the resistance of the pull-down devices. When Data is held high, SW2 is
closed (SW1 is open), and RP is trimmed until Pad = OVDD/2. RP then becomes the resistance of the pull-up
devices. With a properly designed driver RP and RN are close to each other in value, then Z0 = (RP + RN)/2.
Figure 5-6. Driver Impedance Measurement
Data
OV
DD
R
P
SW2
SW1
Pad
R
N
GND
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