参数资料
型号: IBM25PPC750GXEBB6572T
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA292
封装: 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
文件页数: 58/74页
文件大小: 1054K
代理商: IBM25PPC750GXEBB6572T
Datasheet
IBM PowerPC 750GX RISC Microprocessor
DD1.X
750GX_ds_body.fm SA14-2765-02
September 2, 2005
System Design Information
Page 61 of 73
5.7 Thermal Management Information
This section provides thermal management information for the CBGA package for air cooled applications.
Proper thermal control design is primarily dependent upon the system-level design; that is, the heat sink, air
flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be attached
to the package by several methods: adhesive, spring clip to holes in the printed-circuit board or package,
Note: This section is based on preliminary information and is subject to change.
Figure 5-6. IBM RISCWatch JTAG to HRESET, TRST, and SRESET Signal Connector
HRESET from RISCWatch
System HRESET
HRESET to PowerPC 750GX
TRST to PowerPC 750GX
SRESET to PowerPC 750GX
SRESET from RISCWatch
System SRESET
TRST from RISCWatch
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