参数资料
型号: IBM25PPC750L-FB0A400W
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
封装: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件页数: 20/46页
文件大小: 610K
代理商: IBM25PPC750L-FB0A400W
9/30/99
Version 2.0
Datasheet
Page 23
PowerPC 750 SCM RISC Microprocessor
Preliminary Copy
PID8p-750
PowerPC PID8p-750 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the PID8p-750 SCM. IBM offers a ceramic ball grid
array 360 CBGA packages.
Figure 13 (in part A) shows the pinout of the 360 CBGA package as viewed from the top surface. Part B
shows the side profile of the 360 CBGA package to indicate the direction of the top surface view.
Figure 13. Pinout of the 360 CBGA Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Not to Scale
Substrate Assembly.
Encapsulation
View
Part B
Die
Part A
17 18 19
U
V
W
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