参数资料
型号: ICL7660SIPA
厂商: Intersil
文件页数: 2/13页
文件大小: 0K
描述: IC REG SWITCHED CAP DBL INV 8DIP
标准包装: 1,000
类型: 切换式电容器(充电泵),倍增器,反相
输出类型: 可调式
输出数: 1
输出电压: -1.5 V ~ -12 V,±3 V ~ ±24 V
输入电压: 1.5 V ~ 12 V
频率 - 开关: 10kHz,35kHz
电流 - 输出: 45mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 通孔
封装/外壳: 8-DIP(0.300",7.62mm)
包装: 管件
供应商设备封装: 8-PDIP
ICL7660S, ICL7660A
Ordering Information
PART NUMBER
TEMP. RANGE
(NOTE 3)
ICL7660SCBA (Note 1)
ICL7660SCBAZ
PART MARKING
7660 SCBA
7660 SCBAZ
(°C)
0 to +70
0 to +70
PACKAGE
8 Ld SOIC
8 Ld SOIC (Pb-free)
PKG. DWG. #
M8.15
M8.15
(Notes 1, 2)
ICL7660SCPA
ICL7660SCPAZ (Note 2)
ICL7660SIBA (Note 1)
ICL7660SIBAZ
7660S CPA
7660S CPAZ
7660 SIBA
7660 SIBAZ
0 to +70
0 to +70
-40 to +85
-40 to +85
8 Ld PDIP
8 Ld PDIP (Pb-free; Note 4)
8 Ld SOIC
8 Ld SOIC (Pb-free)
E8.3
E8.3
M8.15
M8.15
(Notes 1, 2)
ICL7660SIPA
ICL7660SIPAZ
7660 SIPA
7660S IPAZ
-40 to +85
-40 to +85
8 Ld PDIP
8 Ld PDIP (Pb-free; Note 4)
E8.3
E8.3
(Note 2)
ICL7660ACBA (Note 1)
ICL7660ACBAZA
7660ACBA
7660ACBAZ
0 to 70
0 to 70
8 Ld SOIC (N)
8 Ld SOIC (N) (Pb-free)
M8.15
M8.15
(Notes 1, 2)
ICL7660ACPA
ICL7660ACPAZ (Note 2)
ICL7660AIBA (Note 1)
ICL7660AIBAZA
7660ACPA
7660ACPAZ
7660AIBA
7660AIBAZ
0 to 70
0 to 70
-40 to 85
-40 to 85
8 Ld PDIP
8 Ld PDIP (Pb-free; Note 4)
8 Ld SOIC (N)
8 Ld SOIC (N) (Pb-free)
E8.3
E8.3
M8.15
M8.15
(Notes 1, 2)
NOTES:
1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ICL7660S , ICL7660A . For more information on MSL, please see
Tech Brief TB363 .
4. Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in reflow solder processing applications.
2
FN3179.7
January 23, 2013
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