参数资料
型号: ICS843001AG-21LFT
厂商: IDT, Integrated Device Technology Inc
文件页数: 4/17页
文件大小: 0K
描述: IC SYNTHESIZER LVPECL 24-TSSOP
标准包装: 2,500
系列: HiPerClockS™, FemtoClock™
类型: 频率合成器
PLL: 带旁路
输入: 晶体
输出: LVCMOS,LVPECL,LVTTL
电路数: 1
比率 - 输入:输出: 2:2
差分 - 输入:输出: 无/是
频率 - 最大: 700MHz
除法器/乘法器: 是/无
电源电压: 3.135 V ~ 3.465 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 24-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 24-TSSOP
包装: 带卷 (TR)
其它名称: 843001AG-21LFT
ICS843001-21
FEMTOCLOCKS CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
IDT / ICS LVPECL FREQUENCY SYNTHESIZER
12
ICS843001AG-21 REV. AMARCH 15, 2007
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS843001.21.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS843001-21 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 170mA = 589.05mW
Power (outputs)MAX = 30mW/Loaded Output pair
Total Power_MAX (3.3V, with all outputs switching) = 589.05mW + 30mW = 619.05mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a moderate
air flow of 1 meter per second and a multi-layer board, the appropriate value is 65°C/W per Table 7below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.619W * 65°C/W = 110.2°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board (single layer or multi-layer).
Table 7. Thermal Resitance θJA for 24 Lead TSSOP, Forced Convection
θ
JA vs. Air Flow
Meters per Second
01
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
70°C/W
65
62
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