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| 型号： | ICS85104AGILF |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟及定时 |
| 英文描述： | 85104 SERIES, LOW SKEW CLOCK DRIVER, 4 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO20 |
| 封装： | 6.50 MM X 4.40 MM, 0.92 MM HEIGHT, ROHS COMPLIANT, MO-153, TSSOP-20 |
| 文件页数： | 4/16页 |
| 文件大小： | 302K |
| 代理商： | ICS85104AGILF |
IDT / ICS 0.7V HCSL FANOUT BUFFER
12
ICS85104AGI REV. A MARCH 12, 2008
ICS85104I
LOW SKEW, 1-TO-4, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS85104I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS85104I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD
= 3.3V + 10% = 3.63V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
DD_MAX
* I
DD_MAX
= 3.63V * 27mA = 98.01mW
Power (outputs)
MAX
= 47.3mW/Loaded Output pair
If all outputs are loaded, the total power is 4 * 47.3mW = 189.2mW
Total Power
_MAX
(3.63V, with all outputs switching) = 98.01mW + 189.2mW = 287.21mW
2.
Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in Section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air
flow and a multi-layer board, the appropriate value is 91.1°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.287W * 91.1°C/W = 111.1°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
20-LEADN TSSOP, FORCED CONVECTION
θθθθθ
JA
by Velocity (Meters per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
91.1°C/W
86.7°C/W
84.6°C/W
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ICS85104AGILFT | 功能描述:IC CLOCK BUFFER MUX 2:4 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS85105AGI | 制造商:Integrated Device Technology Inc 功能描述:IC CLK BUFFER 2:5 500MHZ 20TSSOP |
| ICS85105AGILF | 功能描述:IC CLOCK BUFFER MUX 2:5 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS85105AGILFT | 功能描述:IC CLOCK BUFFER MUX 2:5 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS85105AGIT | 制造商:Integrated Device Technology Inc 功能描述:IC CLK BUFFER 2:5 500MHZ 20TSSOP |
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