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参数资料
| 型号： | ICS85108AGILFT |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 3/16页 |
| 文件大小： | 0K |
| 描述： | IC CLK BUFFER 1:8 500MHZ 24TSSOP |
| 标准包装： | 1,000 |
| 系列： | HiPerClockS™ |
| 类型： | 扇出缓冲器（分配） |
| 电路数： | 1 |
| 比率 - 输入:输出： | 1:8 |
| 差分 - 输入:输出： | 是/是 |
| 输入： | HCSL，LVDS，LVHSTL，LVPECL，SSTL |
| 输出： | HCSL |
| 频率 - 最大： | 500MHz |
| 电源电压： | 2.97 V ~ 3.63 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 24-TSSOP |
| 包装： | 带卷 (TR) |
ICS85108I Data Sheet
LOW SKEW, 1-TO-8, DIFFERENTIAL-TO-0.7V HCSL CLOCK DISTRIBUTION CHIP
ICS85108AGI REVISION A OCTOBER 23, 2009
11
2009 Integrated Device Technology, Inc.
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS85108I.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS85108I is the sum of the core power plus the analog power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 3.3V + 10% = 3.63V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VDD_MAX *IDD_MAX = 3.63V * 27mA = 98.01mW
Power (outputs)MAX = 47.3mW/Loaded Output Pair
If all outputs are loaded, the total power is 8 * 47.3mW = 378.4mW
Total Power_MAX = (3.465V, with all outputs switching) = 98.01mW + 378.4mW = 476.41mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature for HiPerClockS devices is 125°C. Limiting the internal transistor junction temperature, Tj, to
125°C ensures that the bond wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming 1 meter per
second and a multi-layer board, the appropriate value is 83.5°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.476W * 83.5°C/W = 124.7°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 6. Thermal Resistance θJA for 24 Lead TSSOP, Forced Convection
θ
JA Vs. Air Flow
Meters per Second
01
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
87.8°C/W
83.5°C/W
81.3°C/W
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相关代理商/技术参数 |
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| ICS85108AGIT | 制造商:Integrated Device Technology Inc 功能描述:IC CLK BUFFER 1:8 500MHZ 24TSSOP |
| ICS8512061AGILF | 功能描述:IC TXRX BIDIR 0.7V 1CH 8-TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:250 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:带卷 (TR) |
| ICS8512061AGILFT | 功能描述:IC TXRX BIDIR 0.7V 1CH 8-TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:250 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:带卷 (TR) |
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