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| 型号： | ICS8624BYILF |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟及定时 |
| 英文描述： | PLL BASED CLOCK DRIVER, 5 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP32 |
| 封装： | 7 X 7 MM, 1.40 MM HEIGHT, LQFP-32 |
| 文件页数： | 2/15页 |
| 文件大小： | 511K |
| 代理商： | ICS8624BYILF |
Integrated
Circuit
Systems, Inc.
ICS8624I
LOW SKEW, 1-TO-5
DIFFERENTIAL-TO-HSTL ZERO DELAY BUFFER
8624BYI
www.icst.com/products/hiperclocks.html
REV. B NOVEMBER 15, 2005
10
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8624I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8624I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX = VDD_MAX * IDD_MAX = 3.465V * 135mA = 467.8mW
Power (outputs)
MAX = 32.8mW/Loaded Output pair
If all outputs are loaded, the total power is 5 * 32.8mW = 164mW
Total Power
_MAX (3.465V, with all outputs switching) = 467.8mW + 164mW = 631.8mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.632W * 42.1°C/W = 111.6°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θθθθθ
JA by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
67.8°C/W
55.9°C/W
50.1°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
47.9°C/W
42.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TABLE 7. THERMAL RESISTANCE
θθθθθ
JA
FOR
32-PIN LQFP, FORCED CONVECTION
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相关代理商/技术参数 |
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| ICS8624BYLF | 功能描述:IC BUFFER ZD 1-5 HSTL 32-LQFP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™ 标准包装:1,000 系列:- 类型:时钟/频率合成器，扇出分配 PLL:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 除法器/乘法器:- 电源电压:- 工作温度:- 安装类型:表面贴装 封装/外壳:56-VFQFN 裸露焊盘 供应商设备封装:56-VFQFP-EP（8x8） 包装:带卷 (TR) 其它名称:844S012AKI-01LFT |
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