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| 型号： | ICS8634BY-01T |
| 元件分类： | 时钟及定时 |
| 英文描述： | 8634 SERIES, PLL BASED CLOCK DRIVER, 5 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP32 |
| 封装： | 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LQFP-32 |
| 文件页数： | 2/16页 |
| 文件大小： | 280K |
| 代理商： | ICS8634BY-01T |
8634BY-01
www.icst.com/products/hiperclocks.html
REV. C NOVEMBER 12, 2004
10
Integrated
Circuit
Systems, Inc.
ICS8634-01
1-TO-5 DIFFERENTIAL-TO-3.3V LVPECL
ZERO DELAY BUFFER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8634-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8634-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX = VCC_MAX * IEE_MAX = 3.465V * 150mA = 520mW
Power (outputs)
MAX = 30.2mW/Loaded Output pair
If all outputs are loaded, the total power is 5 * 30.2mW = 151mW
Total Power
_MAX (3.465V, with all outputs switching) = 520mW + 151mW = 671mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W per Table 7A below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.671W * 42.1°C/W = 98.2°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θθθθθ
JA by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
67.8°C/W
55.9°C/W
50.1°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
47.9°C/W
42.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TABLE 7A. THERMAL RESISTANCE
θθθθθ
JA
FOR
32-PIN LQFP, FORCED CONVECTION
TABLE 7B.
θ
JA
VS
. AIR FLOW TABLE FOR 32 LEAD VFQFN PACKAGE
θθθθθ
JA 0 Air Flow (Linear Feet per Minute)
0
Multi-Layer PCB, JEDEC Standard Test Boards
34.8C/W
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