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| 型号： | ICS8741004AGT |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟及定时 |
| 英文描述： | 8741004 SERIES, PLL BASED CLOCK DRIVER, 4 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO24 |
| 封装： | 4 40 X 7.80 MM, 0.92 MM HEIGHT, MO-153, TSSOP-24 |
| 文件页数： | 6/19页 |
| 文件大小： | 1309K |
| 代理商： | ICS8741004AGT |
ICS8741004
DIFFERENTIAL-TO-LVDS/0.7V DIFFERENTIAL PCI EXPRESS JITTER ATTENUATOR
IDT / ICS PCI EXPRESS JITTER ATTENUATOR
14
ICS8741004AG REV. ANOVEMBER 1, 2007
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS8741004.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS741004 is the sum of the core power plus the analog power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VDD_MAX * (IDD_MAX + IDDA_MAX) = 3.465V * (45mA + 12mA) = 197.5mW
Power (LVDS_output)MAX = VDDO_MAX * IDDO_MAX = 3.465V * 80mA = 227.2mW
Power (HCSL_output)MAX = 45.65mW * 2 = 91.3mW
Total Power_MAX = (3.465V, with all outputs switching) = 197.5mW + 277.2mW + 91.3mW = 556mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air flow
and a multi-layer board, the appropriate value is 82.3°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.556W * 82.3°C/W = 115.8°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board (single layer or multi-layer).
Table 6. Thermal Resistance θJA for 24 Lead TSSOP, Forced Convection
θ
JA Vs. Air Flow
Meters per Second
01
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
82.3°C/W
78.0°C/W
75.9°C/W
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相关代理商/技术参数 |
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|---|---|
| ICS8741004BGILF | 功能描述:IC PCI EXPRSS/JITT ATTEN 24TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 专用 系列:HiPerClockS™, FemtoClock™, PCI Express® (PCIe) 标准包装:1,500 系列:- 类型:时钟缓冲器/驱动器 PLL:是 主要目的:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 电源电压:3.3V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:28-SSOP（0.209"，5.30mm 宽） 供应商设备封装:28-SSOP 包装:带卷 (TR) 其它名称:93786AFT |
| ICS8741004BGILFT | 功能描述:IC PCI EXPRSS/JITT ATTEN 24TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 专用 系列:HiPerClockS™, FemtoClock™, PCI Express® (PCIe) 标准包装:1,500 系列:- 类型:时钟缓冲器/驱动器 PLL:是 主要目的:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 电源电压:3.3V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:28-SSOP（0.209"，5.30mm 宽） 供应商设备封装:28-SSOP 包装:带卷 (TR) 其它名称:93786AFT |
| ICS874208BKILF | 制造商:Integrated Device Technology Inc 功能描述:IC CLK BUFFER/DIVIDER 32VFQFN |
| ICS874208BKILFT | 制造商:Integrated Device Technology Inc 功能描述:IC CLK BUFFER/DIVIDER 32VFQFN |
| ICS87421AMILF | 功能描述:IC CLK GEN DIFF-LVDS 8-SOIC RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™ 标准包装:2,000 系列:- 类型:PLL 频率合成器 PLL:是 输入:晶体 输出:时钟 电路数:1 比率 - 输入:输出:1:1 差分 - 输入:输出:无/无 频率 - 最大:1GHz 除法器/乘法器:是/无 电源电压:4.5 V ~ 5.5 V 工作温度:-20°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-LSSOP（0.175"，4.40mm 宽） 供应商设备封装:16-SSOP 包装:带卷 (TR) 其它名称:NJW1504V-TE1-NDNJW1504V-TE1TR |
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