- 您现在的位置：买卖IC网 > PDF目录8740 > ICS8S89831AKILF (IDT, Integrated Device Technology Inc)IC CLOCK BUFFER 1:4 2.1GHZ 16QFN PDF资料下载
参数资料
| 型号： | ICS8S89831AKILF |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 7/21页 |
| 文件大小： | 0K |
| 描述： | IC CLOCK BUFFER 1:4 2.1GHZ 16QFN |
| 标准包装： | 100 |
| 系列： | HiPerClockS™ |
| 类型： | 扇出缓冲器（分配） |
| 电路数： | 1 |
| 比率 - 输入:输出： | 1:4 |
| 差分 - 输入:输出： | 是/是 |
| 输入： | CML，LVDS，LVPECL，SSTL |
| 输出： | ECL，LVPECL |
| 频率 - 最大： | 2.1GHz |
| 电源电压： | 2.375 V ~ 3.465 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VFQFN 裸露焊盘 |
| 供应商设备封装： | 16-VFQFPN（3x3） |
| 包装： | 管件 |
| 其它名称： | 800-2402-5 ICS8S89831AKILF-ND |
ICS8S89831I Data Sheet
DIFFERENTIAL LVPECL-TO-LVPECL/ECL FANOUT BUFFER
ICS8S89831AKI REVISION A APRIL 26, 2010
15
2010 Integrated Device Technology, Inc.
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS8S89831I.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS8S89831I is the sum of the core power plus the power dissipation in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipation in the load.
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 45mA = 155.925mW
Power (outputs)MAX = 32.94mW/Loaded Output pair
If all outputs are loaded, the total power is 4 * 32.94mW = 131.76mW
Power Dissipation for internal termination RT
Power (RT)MAX = (VIN_MAX)
2 / RT_MIN = (1.2V)2 / 80 = 18mW
Total Power_MAX (3.3V, with all outputs switching) = 155.925mW + 131.76mW + 18mW = 305.685mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad, and directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 74.7°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.306W * 74.7°C/W = 107.9°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 6. Thermal Resistance θJA for 16 Lead VFQFN, Forced Convection
θ
JA by Velocity
Meters per Second
01
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
74.7°C/W
65.3°C/W
58.5°C/W
相关PDF资料 |
PDF描述 |
|---|---|
| VI-2T2-MW-F4 | CONVERTER MOD DC/DC 15V 100W |
| VE-BNF-IU-B1 | CONVERTER MOD DC/DC 72V 200W |
| VE-BNB-IU-B1 | CONVERTER MOD DC/DC 95V 200W |
| VE-B6P-IU-B1 | CONVERTER MOD DC/DC 13.8V 200W |
| VE-B6N-IU-B1 | CONVERTER MOD DC/DC 18.5V 200W |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ICS8S89831AKILFT | 功能描述:IC CLOCK BUFFER 1:4 2.1GHZ 16QFN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS8S89834AKILF | 功能描述:IC CLOCK MUX 2:4 1GHZ 16-VFQFN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS8S89834AKILFT | 功能描述:IC CLOCK MUX 2:4 1GHZ 16-VFQFN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| ICS8S89875AKILF | 制造商:Integrated Device Technology Inc 功能描述:IC CLK MULTPLX 1:2 2.5GHZ 16VFQF |
| ICS8S89875AKILFT | 制造商:Integrated Device Technology Inc 功能描述:IC CLK MULTPLX 1:2 2.5GHZ 16VFQF |
发布紧急采购，3分钟左右您将得到回复。