参数资料
型号: IDT70T3319S133DD
厂商: IDT, Integrated Device Technology Inc
文件页数: 8/27页
文件大小: 0K
描述: IC SRAM 4MBIT 133MHZ 144TQFP
产品变化通告: Product Discontinuation 20/Aug/2008
标准包装: 6
格式 - 存储器: RAM
存储器类型: SRAM - 双端口,同步
存储容量: 4.5M(256K x 18)
速度: 133MHz
接口: 并联
电源电压: 2.4 V ~ 2.6 V
工作温度: 0°C ~ 70°C
封装/外壳: 144-LQFP 裸露焊盘
供应商设备封装: 144-TQFP(20x20)
包装: 托盘
其它名称: 70T3319S133DD
IDT70T3339/19/99S
High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM
Absolute Maximum Ratings (1)
Industrial and Commercial Temperature Ranges
Symbol
Rating
Commercial
Unit
& Industrial
V TERM
(V DD )
V TERM (2)
(V DDQ )
V TERM (2)
(INPUTS and I/O's)
V DD Terminal Voltage
with Respect to GND
V DDQ Terminal Voltage
with Respect to GND
Input and I/O Terminal
Voltage with Respect to GND
-0.5 to 3.6
-0.3 to V DDQ + 0.3
-0.3 to V DDQ + 0.3
V
V
V
T BIAS (3)
T STG
T JN
Temperature Under Bias
Storage Temperature
Junction Temperature
-55 to +125
-65 to +150
+150
o
o
o
C
C
C
I OUT (For V DDQ = 3.3V) DC Output Current
I OUT (For V DDQ = 2.5V) DC Output Current
NOTES:
50
40
mA
mA
5652 tbl 06
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions above those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
2. This is a steady-state DC parameter that applies after the power supply has reached its
nominal operating value. Power sequencing is not necessary; however, the voltage on
any Input or I/O pin cannot exceed V DDQ during power supply ramp up.
3. Ambient Temperature under DC Bias. No AC Conditions. Chip Deselected.
Capacitance (1)
(T A = +25°C, f = 1.0MHz) PQFP ONLY
C OUT
Symbol
C IN
(3)
Parameter
Input Capacitance
Output Capacitance
Conditions (2)
V IN = 3dV
V OUT = 3dV
Max.
8
10.5
Unit
pF
pF
5652 tbl 07
NOTES:
1. These parameters are determined by device characterization, but are not
production tested.
2. 3dV references the interpolated capacitance when the input and output switch
from 0V to 3V or from 3V to 0V.
3. C OUT also references C I/O .
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range (V DD = 2.5V ± 100mV)
70T3339/19/99S
JTAG & ZZ Input Leakage Current
Output Leakage Current
Symbol
|I LI |
|I LI |
|I LO |
Parameter
Input Leakage Current (1)
(1,3)
(1,2)
Test Conditions
V DDQ = Max., V IN = 0V to V DDQ
V DD = Max. , V IN = 0V to V DD
CE 0 = V IH or CE 1 = V IL , V OUT = 0V to V DDQ
Min.
___
___
___
Max.
10
±30
10
Unit
μA
μA
μA
V OL (3.3V)
Output Low Voltage
(1)
I OL = +4mA, V DDQ = Min.
___
0.4
V
V OH (3.3V)
Output High Voltage
(1)
I OH = -4mA, V DDQ = Min.
2.4
___
V
V OL (2.5V)
Output Low Voltage
(1)
I OL = +2mA, V DDQ = Min.
___
0.4
V
V OH (2.5V)
Output High Voltage (1)
I OH = -2mA, V DDQ = Min.
2.0
___
V
NOTES:
1. V DDQ is selectable (3.3V/2.5V) via OPT pins. Refer to p.6 for details.
2. Applicable only for TMS, TDI and TRST inputs.
3. Outputs tested in tri-state mode.
8
6.42
5652 tbl 08
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