- 您现在的位置：买卖IC网 > PDF目录4123 > IDT7134SA55P (IDT, Integrated Device Technology Inc)IC SRAM 32KBIT 55NS 48DIP PDF资料下载
参数资料
| 型号： | IDT7134SA55P |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 2/12页 |
| 文件大小： | 0K |
| 描述： | IC SRAM 32KBIT 55NS 48DIP |
| 标准包装： | 7 |
| 格式 - 存储器： | RAM |
| 存储器类型： | SRAM - 双端口，异步 |
| 存储容量： | 32K (4K x 8) |
| 速度： | 55ns |
| 接口： | 并联 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 48-DIP（0.600"，15.24mm） |
| 供应商设备封装： | 48-PDIP |
| 包装： | 管件 |
| 其它名称： | 7134SA55P |
IDT7134SA/LA
High-Speed 4K x 8 Dual-Port Static SRAM
Description
The IDT7134 is a high-speed 4K x 8 Dual-Port Static RAM
designed to be used in systems where on-chip hardware port arbitration
is not needed. This part lends itself to those systems which cannot
tolerate wait states or are designed to be able to externally arbitrate or
withstand contention when both sides simultaneously access the
same Dual-Port RAM location.
The IDT7134 provides two independent ports with separate control,
address, and I/O pins that permit independent, asynchronous access
for reads or writes to any location in memory. It is the user’s responsibility
to ensure data integrity when simultaneously accessing the same
memory location from both ports. An automatic power down feature,
Military, Industrial and Commercial Temperature Ranges
controlled by CE , permits the on-chip circuitry of each port to enter a very
low standby power mode.
Fabricated using CMOS high-performance technology, these Dual-
Ports typically operate on only 700mW of power. Low-power (LA)
versions offer battery backup data retention capability, with each port
typically consuming 200μW from a 2V battery.
The IDT7134 is packaged on either a sidebraze or plastic 48-pin
DIP, 48-pin LCC, 52-pin PLCC and 48-pin Flatpack. Military grade
product is manufactured in compliance with MIL-PRF-38535 QML,
making it ideally suited to military temperature applications demanding the
highest level of performance and reliability.
Pin Configurations (1,2,3)
INDEX
CE L
R/ W L
A 11L
A 10L
OE L
A 0L
A 1L
1 48
2 47
3 46
4 45
5 44
6 43
7 42
V CC
CE R
R/ W R
A 11R
A 10R
OE R
A 0R
A 1L
A 2L
A 3L
A 4L
8
9
10
11
7 6 5 4 3 2
1
52 51 50 49 48 47
46
45
44
43
OE R
A 0R
A 1R
A 2R
9
40
P48-1
10
39
C48-2
13
36
A 2L
A 3L
A 4L
A 5L
A 6L
A 7L
A 8L
A 9L
8 IDT7134P or C 41
(4)
&
(4)
11 38
12 48-Pin 37
Top
View (5)
14 35
15 34
A 1R
A 2R
A 3R
A 4R
A 5R
A 6R
A 7R
A 8R
A 5L
A 6L
A 7L
A 8L
A 9L
I/O 0L
12
13
14
15
16
17
IDT7134J
J52-1 (4)
52-Pin PLCC
Top View (5)
42
41
40
39
38
37
A 3R
A 4R
A 5R
A 6R
A 7R
A 8R
I/O 0L
I/O 1L
I/O 2L
I/O 3L
I/O 4L
16
17
18
19
20
33
32
31
30
29
A 9R
I/O 7R
I/O 6R
I/O 5R
I/O 4R
I/O 1L
I/O 2L
I/O 3L
18
19
20
36
35
34
21 22 23 24 25 26 27 28 29 30 31 32 33
A 9R
N/C
I/O 7R
I/O 5L
21
28
I/O 3R
I/O 6L
I/O 7L
GND
22
23
24
27
26
25
I/O 2R
I/O 1R
I/O 0R
2720 drw 03
,
2720 drw 02
INDEX
A 1L
7
6 5 4 3
2
1
48 47 46 45 44 43
42
A 0R
A 2L
A 3L
8
9
41
40
A 1R
A 2R
A 4L
A 5L
A 6L
A 7L
10
11
12
13
IDT7134L48 or F
L48-1 (4)
&
F48-1 (4)
39
38
37
36
A 3R
A 4R
A 5R
A 6R
NOTES:
1. All V CC pins must be connected to the power supply.
2. All GND pins must be connected to the ground supply.
3. P48-1 package body is approximately .55 in x 2.43 in x .18 in.
A 8L
A 9L
I/O 0L
I/O 1L
14
15
16
17
48-Pin LCC/Flatpack
Top View (5)
35
34
33
32
A 7R
A 8R
A 9R
I/O 7R
,
C48-2 package body is approximately .62 in x 2.43 in x .15 in.
J52-1 package body is approximately .75 in x .75 in x .17 in.
L48-1 package body is approximately .57 in x .57 in x .68 in.
F48-1 package body is approxiamtely .75 in x .75 in x .11 in.
4. This package code is used to reference the package diagram.
I/O 2L
18 31
19 20 21 22 23 24 25 26 27 28 29 30
I/O 6R
2720 drw 04
5. This text does not indicate orientation of actual part-marking.
2
相关PDF资料 |
PDF描述 |
|---|---|
| AMC44DRXI | CONN EDGECARD 88POS .100 DIP SLD |
| ACB75DHAN | CONN EDGECARD 150PS R/A .050 DIP |
| IDT7132SA35P | IC SRAM 16KBIT 35NS 48DIP |
| ACB75DHAD | CONN EDGECARD 150PS R/A .050 DIP |
| IDT7140LA35PF | IC SRAM 8KBIT 35NS 64TQFP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IDT7134SA70CB | 制造商:Integrated Device Technology Inc 功能描述: 制造商:Integrated Device Technology Inc 功能描述:IC SRAM 32KBIT 70NS SB48 |
| IDT7134SA70J | 功能描述:IC SRAM 32KBIT 70NS 52PLCC RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M（2M x 8，1M x 16） 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA（6x8） 包装:带卷 (TR) |
| IDT7134SA70J8 | 功能描述:IC SRAM 32KBIT 70NS 52PLCC RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M（2M x 8，1M x 16） 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA（6x8） 包装:带卷 (TR) |
| IDT7134SA70L48B | 制造商:Integrated Device Technology Inc 功能描述:IC SRAM 32KBIT 70NS 48LCC |
| IDT7134SA70P | 功能描述:IC SRAM 32KBIT 70NS 48DIP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M（2M x 8，1M x 16） 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA（6x8） 包装:带卷 (TR) |
发布紧急采购，3分钟左右您将得到回复。