参数资料
型号: IDT71V321S55TF
厂商: IDT, Integrated Device Technology Inc
文件页数: 8/15页
文件大小: 0K
描述: IC SRAM 16KBIT 55NS 64STQFP
标准包装: 40
格式 - 存储器: RAM
存储器类型: SRAM - 双端口,异步
存储容量: 16K (2K x 8)
速度: 55ns
接口: 并联
电源电压: 3 V ~ 3.6 V
工作温度: 0°C ~ 70°C
封装/外壳: 64-LQFP
供应商设备封装: 64-TQFP(10x10)
包装: 托盘
其它名称: 71V321S55TF
IDT71V321/71V421S/L
High Speed 3.3V 2K x 8 Dual-Port Static RAM with Interrupts
Industrial and Commercial Temperature Ranges
Timing Waveform of Write Cycle No. 1, (R/ W Controlled Timing) (1,5,8)
t WC
ADDRESS
t HZ (7)
OE
t AW
CE
t AS (6)
t WP (2)
t WR (3)
t HZ (7)
R/ W
t WZ (7)
t OW
DATA OUT
(4)
t DW
t DH
(4)
DATA IN
3026 drw 08
Timing Waveform of Write Cycle No. 2, ( CE Controlled Timing) (1,5)
t WC
ADDRESS
t AW
CE
t AS (6)
t EW (2)
t WR
(3)
R/ W
t DW
t DH
DATA IN
3026 drw 09
NOTES:
1. R/ W or CE must be HIGH during all address transitions.
2. A write occurs during the overlap (t EW or t WP ) of CE = V IL and R/W= V IL .
3. t WR is measured from the earlier of CE or R/ W going HIGH to the end of the write cycle.
4. During this period, the l/O pins are in the output state and input signals must not be applied.
5. If the CE LOW transition occurs simultaneously with or after the R/ W LOW transition, the outputs remain in the High-impedance state.
6. Timing depends on which enable signal ( CE or R/ W ) is asserted last.
7. This parameter is determined to be device characterization, but is not production tested. Transition is measured 0mV from steady state with the Output Test
Load (Figure 2).
8. If OE is LOW during a R/ W controlled write cycle, the write pulse width must be the larger of t WP or (t WZ + t DW ) to allow the I/O drivers to turn off data to be
placed on the bus for the required t DW . If OE is HIGH during a R/ W controlled write cycle, this requirement does not apply and the write pulse can be as short
as the specified t WP .
8
6.42
相关PDF资料
PDF描述
IDT71321SA55TF IC SRAM 16KBIT 55NS 64STQFP
XC6SLX75T-4CSG484C IC FPGA SPARTAN 6 74K 484CSGBGA
XC6SLX45T-4FGG484C IC FPGA SPARTAN 6 43K 484FGGBGA
ACC65DRAH CONN EDGECARD 130PS .100 R/A DIP
1-1734592-3 CONN FPC 13POS .5MM RT ANG SMD
相关代理商/技术参数
参数描述
IDT71V321S55TF8 功能描述:IC SRAM 16KBIT 55NS 64STQFP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M(2M x 8,1M x 16) 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA(6x8) 包装:带卷 (TR)
IDT71V3556S100BG 功能描述:IC SRAM 4MBIT 100MHZ 119BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 产品变化通告:Product Discontinuation 05/Nov/2008 标准包装:84 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 ZBT 存储容量:4.5M(128K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:119-BGA 供应商设备封装:119-PBGA(14x22) 包装:托盘 其它名称:71V3557SA75BGI
IDT71V3556S100BG8 功能描述:IC SRAM 4MBIT 100MHZ 119BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 产品变化通告:Product Discontinuation 05/Nov/2008 标准包装:84 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 ZBT 存储容量:4.5M(128K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:119-BGA 供应商设备封装:119-PBGA(14x22) 包装:托盘 其它名称:71V3557SA75BGI
IDT71V3556S100BGI 功能描述:IC SRAM 4MBIT 100MHZ 119BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 产品变化通告:Product Discontinuation 05/Nov/2008 标准包装:84 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 ZBT 存储容量:4.5M(128K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:119-BGA 供应商设备封装:119-PBGA(14x22) 包装:托盘 其它名称:71V3557SA75BGI
IDT71V3556S100BGI8 功能描述:IC SRAM 4MBIT 100MHZ 119BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 产品变化通告:Product Discontinuation 05/Nov/2008 标准包装:84 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 ZBT 存储容量:4.5M(128K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:119-BGA 供应商设备封装:119-PBGA(14x22) 包装:托盘 其它名称:71V3557SA75BGI