参数资料
型号: IDT74SSTUBF32865ABK
厂商: IDT, Integrated Device Technology Inc
文件页数: 14/16页
文件大小: 0K
描述: IC BUFFER 28BIT 1:2 REG 160-BGA
产品变化通告: Product Discontinuation 09/Dec/2011
标准包装: 119
逻辑类型: 1:2 寄存缓冲器,带奇偶位
电源电压: 1.7 V ~ 1.9 V
位数: 28
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 160-LFBGA
供应商设备封装: 160-CABGA(9x13)
包装: 托盘
其它名称: 74SSTUBF32865ABK
IDT74SSTUBF32865A
28-BIT 1:2 REGISTERED BUFFER WITH PARITY
COMMERCIAL TEMPERATURE GRADE
28-BIT 1:2 REGISTERED BUFFER WITH PARITY
7
IDT74SSTUBF32865A
7092/11
Absolute Maximum Ratings
Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions above
those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
Item
Rating
Supply Voltage, VDD
-0.5V to 2.5V
Input Voltage Range, VI1
1
The input and output negative voltage ratings may be exceeded if the ratings of the I/P and
O/P clamp current are observed.
-0.5V to VDD + 2.5V
Output Voltage Range, VO1,2
2
This current will flow only when the output is in the high state level VO > VDDQ.
-0.5V to VDDQ + 0.5V
Input Clamp Current, IIK
±50mA
Output Clamp Current, IOK
±50mA
Continuous Output Clamp Current, IO
±50mA
Continuous Current through each VDD or GND
±100mA
Package Thermal Impedance (
θja)3
3
The package thermal impedance is calculated in accordance with JESD 51.
0m/s Airflow
44.3
° C/W
1m/s Airflow
38.1
° C/W
Storage Temperature, TSTG
-65 to +150
° C
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