参数资料
型号: IDT89HPES16NT2ZBBCG8
厂商: IDT, Integrated Device Technology Inc
文件页数: 4/29页
文件大小: 0K
描述: IC PCI SW 16LANE 2PORT 484-CABGA
标准包装: 600
系列: PRECISE™
类型: PCI Express 开关 - Gen1
应用: 服务器,储存,通信,嵌入式,消费品
安装类型: 表面贴装
封装/外壳: 484-BGA
供应商设备封装: 484-CABGA(23x23)
包装: 带卷 (TR)
其它名称: 89HPES16NT2ZBBCG8
12 of 29
January 5, 2009
IDT 89HPES16NT2 Data Sheet
Recommended Operating Temperature
Power Consumption
Typical power is measured under the following conditions: 25°C Ambient, 35% total link usage on all ports, typical voltages defined in Table 14.
Maximum power is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximum voltages defined in
All power measurements assume that the part is mounted on a 10 layer printed circuit board with 0 LFM airflow.
Thermal Considerations
This section describes thermal considerations for the PES16NT2 (23mm2 BCG484 package). The data in Table 15 below contains information that
is relevant to the thermal performance of the PES16NT2 switch.
Note: The parameter θJA(eff) is not the absolute thermal resistance for the package as defined by JEDEC (JESD-51). Because resistance
can vary with the number of board layers, size of the board, and airflow, θJA(eff) is the effective thermal resistance. The values for effective
θJA given above are based on a 10-layer, standard height, full length (4.3”x12.2”) PCIe add-in card.
Grade
Temperature
Commercial
0
°C to +70°C Ambient
Table 13 PES16NT2 Operating Temperatures
Number of
Connected Lanes:
Port-A/Port-C
Core (Watts)
(1.0V supply)
PCIe Digital
(Watts)
(1.0V supply)
PCIe Analog
(Watts)
(1.0V supply)
PCIe Termin-
ation (Watts)
(1.5V supply)
I/O (Watts)
(3.3V supply)
Total (Watts)
Typ
Max
Typ
Max
Typ
Max
Typ
Max
Typ
Max
Typ
Max
8/8
472
546
697
905
266
345
354
440
1
3
0.47
0.60
0.70
1.00
0.27
0.38
0.53
0.69
0.003
0.01
1.97
2.68
Table 14 PES16NT2 Power Consumption
Symbol
Parameter
Value
Units
Conditions
TJ(max)
Junction Temperature
125
oCMaximum
TA(max)
Ambient Temperature
70
oC
Maximum for commercial-rated products
θJA(effective)
Effective Thermal Resistance, Junction-to-Ambient
11.5
oC/W
Zero air flow
9.6
oC/W
1 m/S air flow
9.0
oC/W
2 m/S air flow
θJB
Thermal Resistance, Junction-to-Board
10.9
oC/W
θJC
Thermal Resistance, Junction-to-Case
5
oC/W
P
Power Dissipation of the Device
2.68
Watts
Maximum
Table 15 Thermal Specifications for PES16NT2, 23x23mm BCG484 Package
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