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参数资料
| 型号： | IR3009 |
| 厂商： | International Rectifier |
| 英文描述： | 3 PHASE OPTERON, ATHLON, OR VR10.X CONTROL IC |
| 中文描述： | 3相皓龙，速龙，或控制IC的VR10.X |
| 文件页数： | 35/39页 |
| 文件大小： | 693K |
| 代理商： | IR3009 |
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IR3093
Page 35 of 39
07/15/04
PCB AND STENCIL DESIGN METHODOLOGY
x
7x7
x
48 Lead
x
0.5mm pitch MLPQ
See Figures 14-16.
PCB Metal Design (0.5mm Pitch Leads)
1. Lead land width should be equal to nominal part lead width. The minimum lead to lead
spacing should be
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2. Lead land length should be equal to maximum part lead length + 0.2 mm outboard extension +
0.05mm inboard extension. The outboard extension ensures a large and inspectable toe fillet,
and the inboard extension will accommodate any part misalignment and ensure a fillet.
3. Center pad land length and width should be = maximum part pad length and width. However,
the minimum metal to metal spacing should be
Copper and
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4. Sixteen 0.30mm diameter vias shall be placed in the pad land spaced at 1.2mm, and
connected to ground to minimize the noise effect on the IC, and to transfer heat to the PCB.
PCB Solder Resist Design (0.5mm Pitch Leads)
1. Lead lands. The solder resist should be pulled away from the metal lead lands by a minimum
of 0.060mm. The solder resist mis-alignment is a maximum of 0.050mm and it is
recommended that the lead lands are all NSMD. Therefore pulling the S/R 0.060mm will
always ensure NSMD pads.
2. The minimum solder resist width is 0.13mm, therefore it is recommended that the solder resist
is completely removed from between the lead lands forming a single opening for each “group”
of lead lands.
3. At the inside corner of the solder resist where the lead land groups meet, it is recommended to
provide a fillet so a solder resist width of
4. Land Pad. The land pad should be SMD, with a minimum overlap of the solder resist onto the
copper of 0.060mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is
allowable to have the solder resist opening for the land pad to be smaller than the part pad.
5. Ensure that the solder resist in-between the lead lands and the pad land is
the high aspect ratio of the solder resist strip separating the lead lands from the pad land.
6. The single via in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm
larger than the diameter of the via.
Stencil Design (0.5mm Pitch Leads)
1. The stencil apertures for the lead lands should be approximately 80% of the area of the lead
lands. Reducing the amount of solder deposited will minimize the occurrence of lead shorts.
Since for 0.5mm pitch devices the leads are only 0.25mm wide, the stencil apertures should
not be made narrower; openings in stencils < 0.25mm wide are difficult to maintain repeatable
solder release.
2. The stencil lead land apertures should therefore be shortened in length by 80% and centered
on the lead land.
3. The center land pad aperture should be striped with 0.25mm wide openings and spaces to
deposit approximately 50% area of solder on the center pad. If too much solder is deposited
on the center land pad the part will float and the lead lands will be open.
4. The maximum length and width of the center land pad stencil aperture should be equal to the
solder resist opening minus an annular 0.2mm pull back to decrease the incidence of shorting
the center land to the lead lands when the part is pushed into the solder paste.
PP
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相关PDF资料 |
PDF描述 |
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| IR3093M | 3 PHASE OPTERON, ATHLON, OR VR10.X CONTROL IC |
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