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参数资料
| 型号： | IR3088AM |
| 厂商： | International Rectifier |
| 英文描述： | XPHASETM PHASE IC WITH FAULT AND OVERTEMP DETECT |
| 中文描述： | XPHASETM相集成电路及超温故障检测 |
| 文件页数： | 32/34页 |
| 文件大小： | 1264K |
| 代理商： | IR3088AM |
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IR3088A
Solder Resist
The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder
resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non Solder
Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
The minimum solder resist width is 0.13mm, therefore it is recommended that the solder resist is completely
removed from between the lead lands forming a single opening for each “group” of lead lands.
At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a
fillet so a solder resist width of
≥
0.17mm remains.
The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto the
copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable to have
the solder resist opening for the land pad to be smaller than the part pad.
Ensure that the solder resist in-between the lead lands and the pad land is
≥
0.15mm due to the high aspect
ratio of the solder resist strip separating the lead lands from the pad land.
The 4 vias in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm larger than the
diameter of the via.
Page 32 of 34
9/30
/04
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| IR3088AMPBF | 功能描述:IC XPHASE CONTROL 20L-MLPQ RoHS:是 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:XPhase™ 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:37 系列:- 应用:医疗用超声波成像，声纳 电流 - 电源:- 电源电压:2.37 V ~ 6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:56-WFQFN 裸露焊盘 供应商设备封装:56-TQFN-EP（8x8） 包装:管件 |
| IR3088AMTR | 功能描述:IC XPHASE W/FAULT DET 20L-MLPQ RoHS:否 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:XPhase™ 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:37 系列:- 应用:医疗用超声波成像，声纳 电流 - 电源:- 电源电压:2.37 V ~ 6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:56-WFQFN 裸露焊盘 供应商设备封装:56-TQFN-EP（8x8） 包装:管件 |
| IR3088AMTRPBF | 功能描述:开关变换器、稳压器与控制器 XPHASE IC W/ FAULT OVERTEMP DETECT RoHS:否 制造商:Texas Instruments 输出电压:1.2 V to 10 V 输出电流:300 mA 输出功率: 输入电压:3 V to 17 V 开关频率:1 MHz 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:WSON-8 封装:Reel |
| IR3088APBF | 制造商:IRF 制造商全称:International Rectifier 功能描述:XPHASETM PHASE IC WITH FAULT AND OVERTEMP DETECT |
| IR3088M | 功能描述:IC XPHASE W/FAULT DET 20L-MLPQ RoHS:否 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:XPhase™ 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:37 系列:- 应用:医疗用超声波成像，声纳 电流 - 电源:- 电源电压:2.37 V ~ 6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:56-WFQFN 裸露焊盘 供应商设备封装:56-TQFN-EP（8x8） 包装:管件 |
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