参数资料
型号: IR3550MTRPBF
厂商: International Rectifier
文件页数: 19/22页
文件大小: 0K
描述: IC DRIVER GATE 60A PQFN
标准包装: 1
系列: *
其它名称: IR3550MTRPBFDKR
60A Integrated PowIRstage?
IR3550
SOLDER RESIST
? The solder resist should be pulled away from
the metal lead lands by a minimum of 0.06mm.
The solder resist miss-alignment is a maximum
of 0.05mm and it is recommended that the low
power signal lead lands are all Non Solder Mask
Defined (NSMD). Therefore pulling the S/R
0.06mm will always ensure NSMD pads.
? The minimum solder resist width is 0.13mm
? The dimensions of power land pads, VIN, PGND,
TGND and SW, are Non Solder Mask Defined
(NSMD). The equivalent PCB layout becomes
Solder Mask Defined (SMD) after power shape
routing.
? Ensure that the solder resist in-between the lead
lands and the pad land is ≥ 0.15mm due to the
high aspect ratio of the solder resist strip
separating the lead lands from the pad land.
typical.
? At the inside corner of the solder resist where
the lead land groups meet, it is recommended
to provide a fillet so a solder resist width of ≥
0.17mm remains.
Figure 34: Solder resist
* Contact International Rectifier to receive an electronic PCB Library file in Cadence Allegro or CAD DXF/DWG format.
19
March 12, 2012 | FINAL DATASHEET
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