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参数资料
| 型号： | IRDC3629A |
| 厂商： | International Rectifier |
| 文件页数： | 20/23页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL SYNC BUCK CONTROLLER |
| 标准包装： | 1 |
| 系列： | * |
IR3629/IR3629A MPbF
Solder Resist
The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The
solder resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all
Non Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
The minimum solder resist width is 0.13mm.
At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide
a fillet so a solder resist width of ≥ 0.17mm remains.
The land pad should be Non Solder Mask Defined (NSMD), with a minimum pullback of the solder
resist off the copper of 0.06mm to accommodate solder resist mis-alignment.
Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high
aspect ratio of the solder resist strip separating the lead lands from the pad land.
Each via in the land pad should be tented or plugged from bottom boardside with solder resist.
11/29/2007
20
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