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参数资料
| 型号： | IRDC3629A |
| 厂商： | International Rectifier |
| 文件页数： | 21/23页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL SYNC BUCK CONTROLLER |
| 标准包装： | 1 |
| 系列： | * |
IR3629/IR3629A MPbF
Stencil Design
The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands.
Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm
pitch devices the leads are only 0.25mm wide, the stencil apertures should not be made narrower;
openings in stencils < 0.25mm wide are difficult to maintain repeatable solder release.
The stencil lead land apertures should therefore be shortened in length by 80% and centered on the
lead land.
The land pad aperture should deposit approximately 50% area of solder on the center pad. If too
much solder is deposited on the center pad the part will float and the lead lands will be open.
The maximum length and width of the land pad stencil aperture should be equal to the solder resist
opening minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the
lead lands when the part is pushed into the solder paste.
11/29/2007
21
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