参数资料
型号: IRF1310NL
厂商: International Rectifier
文件页数: 2/11页
文件大小: 0K
描述: MOSFET N-CH 100V 42A TO-262
标准包装: 50
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 100V
电流 - 连续漏极(Id) @ 25° C: 42A
开态Rds(最大)@ Id, Vgs @ 25° C: 36 毫欧 @ 22A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 110nC @ 10V
输入电容 (Ciss) @ Vds: 1900pF @ 25V
功率 - 最大: 3.8W
安装类型: 通孔
封装/外壳: TO-262-3,长引线,I²Pak,TO-262AA
供应商设备封装: TO-262
包装: 管件
其它名称: *IRF1310NL
IRF1310NS/L
Electrical Characteristics @ T J = 25°C (unless otherwise specified)
Parameter
Min.
Typ.
Max. Units
Conditions
V (BR)DSS
Drain-to-Source Breakdown Voltage
100
–––
––– V V GS = 0V, I D = 250μA
? V (BR)DSS / ? T J Breakdown Voltage Temp. Coefficient
–––
0.11
––– V/°C
Reference to 25°C, I D = 1mA ?
R DS(on)
Static Drain-to-Source On-Resistance
–––
–––
0.036
?
V GS = 10V, I D = 22A ?
––– R G = 3.6 ?
V GS(th)
g fs
I DSS
I GSS
Q g
Q gs
Q gd
t d(on)
t r
t d(off)
t f
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
2.0
14
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
11
56
45
40
4.0 V V DS = V GS , I D = 250μA
––– S V DS = 25V, I D = 22A ?
25 V DS = 100V, V GS = 0V
μA
250 V DS = 80V, V GS = 0V, T J = 150°C
100 V GS = 20V
nA
-100 V GS = -20V
110 I D = 22A
15 nC V DS = 80V
58 V GS = 10V, See Fig. 6 and 13 ??
––– V DD = 50V
––– I D = 22A
ns
––– R D = 2.9 ?, See Fig. 10 ??
L S
Internal Source Inductance
–––
7.5
–––
nH
Between lead,
and center of die contact
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
1900
450
230
––– V GS = 0V
––– pF V DS = 25V
––– ? = 1.0MHz, See Fig. 5 ?
Source-Drain Ratings and Characteristics
Parameter
Min. Typ. Max. Units
Conditions
I S
I SM
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) ??
––– –––
––– –––
42
140
A
MOSFET symbol
showing the
integral reverse
p-n junction diode.
G
D
S
V SD
t rr
Q rr
t on
Notes:
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
––– ––– 1.3 V T J = 25°C, I S =22A, V GS = 0V ?
––– 180 270 ns T J = 25°C, I F = 22A
––– 1.2 1.8 μC di/dt = 100A/μs ??
Intrinsic turn-on time is negligible (turn-on is dominated by L S +L D )
? Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
? Starting T J = 25°C, L = 1.7mH
R G = 25 ? , I AS = 22A. (See Figure 12)
? Pulse width ≤ 300μs; duty cycle ≤ 2%.
? Uses IRF1310N data and test conditions
? I SD ≤ 22A, di/dt ≤ 180A/μs, V DD ≤ V (BR)DSS ,
T J ≤ 175°C
** When mounted on 1" square PCB ( FR-4 or G-10 Material ).
For recommended soldering techniques refer to application note #AN-994.
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