参数资料
型号: IRF3315STRR
厂商: International Rectifier
文件页数: 2/10页
文件大小: 0K
描述: MOSFET N-CH 150V 21A D2PAK
标准包装: 800
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 150V
电流 - 连续漏极(Id) @ 25° C: 21A
开态Rds(最大)@ Id, Vgs @ 25° C: 82 毫欧 @ 12A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 95nC @ 10V
输入电容 (Ciss) @ Vds: 1300pF @ 25V
功率 - 最大: 3.8W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: D2PAK
包装: 带卷 (TR)
IRF3315S/L
Electrical Characteristics @ T J = 25°C (unless otherwise specified)
Parameter
Min.
Typ.
Max. Units
Conditions
V (BR)DSS
Drain-to-Source Breakdown Voltage
150
–––
––– V V GS = 0V, I D = 250μA
? V (BR)DSS / ? T J Breakdown Voltage Temp. Coefficient
–––
0.187
–––
V/°C Reference to 25°C, I D = 1mA ?
R DS(on)
Static Drain-to-Source On-Resistance
–––
–––
0.082
?
V GS = 10V, I D = 12A ?
––– R G = 5.1 ?
V GS(th)
g fs
I DSS
I GSS
Q g
Q gs
Q gd
t d(on)
t r
t d(off)
t f
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
2.0
17
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
9.6
32
49
38
4.0 V V DS = V GS , I D = 250μA
––– S V DS = 50V, I D = 12A ?
25 V DS = 150V, V GS = 0V
μA
250 V DS = 120V, V GS = 0V, T J = 125°C
100 V GS = 20V
nA
-100 V GS = -20V
95 I D = 12A
11 nC V DS = 120V
47 V GS = 10V, See Fig. 6 and 13 ??
––– V DD = 75V
––– I D = 12A
ns
––– R D = 5.9 ?, See Fig. 10 ??
L S
Internal Source Inductance
–––
7.5
–––
nH
Between lead,
and center of die contact
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
1300
300
160
––– V GS = 0V
––– pF V DS = 25V
––– ? = 1.0MHz, See Fig. 5 ?
Source-Drain Ratings and Characteristics
Parameter
Min. Typ. Max. Units
Conditions
I S
I SM
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) ?
––– –––
––– –––
21
84
A
MOSFET symbol
showing the
integral reverse
p-n junction diode.
G
D
S
V SD
t rr
Q rr
t on
Notes:
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
––– ––– 1.3 V T J = 25°C, I S = 43A, V GS = 0V ?
––– 174 260 ns T J = 25°C, I F = 43A
––– 1.2 1.7 μC di/dt = 100A/μs ??
Intrinsic turn-on time is negligible (turn-on is dominated by L S +L D )
? Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
? V DD = 25V, starting T J = 25°C, L = 4.9 mH
R G = 25 ? , I AS = 12A. (See Figure 12)
? Pulse width ≤ 300μs; duty cycle ≤ 2%.
? Uses IRF3315 data and test conditions
? I SD ≤ 12A, di/dt ≤ 140A/μs, V DD ≤ V (BR)DSS ,
T J ≤ 175°C
** When mounted on 1" square PCB ( FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
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