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参数资料
| 型号： | IRF530NLPBF |
| 厂商： | International Rectifier |
| 英文描述： | HEXFET Power MOSFET |
| 中文描述： | HEXFET功率MOSFET |
| 文件页数： | 1/10页 |
| 文件大小： | 283K |
| 代理商： | IRF530NLPBF |
IRF530NSPbF
IRF530NLPbF
HEXFET
Power MOSFET
Parameter
Typ.
–––
–––
Max.
2.15
40
Units
R
θ
JC
R
θ
JA
Junction-to-Case
Junction-to-Ambient (PCB Mounted,steady-state)**
Thermal Resistance
www.irf.com
1
V
DSS
= 100V
R
DS(on)
= 90m
I
D
= 17A
S
D
G
Advanced HEXFET
Power MOSFETs from International Rectifier
utilize advanced processing techniques to achieve extremely low on-
resistance per silicon area. This benefit, combined with the fast
switching speed and ruggedized device design that HEXFET power
MOSFETs are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of applications.
The D
2
Pak is a surface mount power package capable of accommodating
die sizes up to HEX-4. It provides the highest power capability and the
lowest possible on-resistance in any existing surface mount package. The
D
2
Pak is suitable for high current applications because of its low internal
connection resistance and can dissipate up to 2.0W in a typical surface
mount application.
The through-hole version (IRF530NL) is available for low-profile applications.
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
Lead-Free
Description
Absolute Maximum Ratings
Parameter
Max.
17
12
60
3.8
70
0.47
± 20
9.0
7.0
7.4
Units
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
A
= 25°C
P
D
@T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
A
W
W
W/°C
V
A
mJ
V/ns
V
GS
I
AR
E
AR
dv/dt
T
J
T
STG
-55 to + 175
°C
300 (1.6mm from case )
D
2
Pak
IRF530NSPbF
TO-262
IRF530NLPbF
°C/W
PD - 95100
相关PDF资料 |
PDF描述 |
|---|---|
| IRF530NSPBF | HEXFET Power MOSFET |
| IRF530N | Power MOSFET(Vdss=100V, Rds(on)=90mohm, Id=17A) |
| IRF530N | 22A, 100V, 0.064 Ohm, N-Channel Power MOSFET |
| IRF530S | Power MOSFET(Vdss=100V, Rds(on)=0.16ohm, Id=14A) |
| IRF540PBF | HEXFET㈢ Power MOSFET |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IRF530NLPBF | 制造商:International Rectifier 功能描述:MOSFET |
| IRF530NPBF | 功能描述:MOSFET MOSFT 100V 17A 90mOhm 24.7nC RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
| IRF530NS | 功能描述:MOSFET N-CH 100V 17A D2PAK RoHS:否 类别:分离式半导体产品 >> FET - 单 系列:HEXFET® 标准包装:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道，金属氧化物 FET 特点:逻辑电平门 漏极至源极电压(Vdss):200V 电流 - 连续漏极(Id) @ 25° C:18A 开态Rds（最大）@ Id, Vgs @ 25° C:180 毫欧 @ 9A，10V Id 时的 Vgs(th)（最大）:4V @ 250µA 闸电荷(Qg) @ Vgs:72nC @ 10V 输入电容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安装类型:通孔 封装/外壳:TO-220-3 整包 供应商设备封装:TO-220FP 包装:管件 |
| IRF530NSHR | 制造商:International Rectifier 功能描述:Trans MOSFET N-CH 100V 17A 3-Pin(2+Tab) D2PAK |
| IRF530NSPBF | 功能描述:MOSFET 100V 1 N-CH HEXFET 90mOhms 24.7nC RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
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