参数资料
型号: IRF540NL
厂商: International Rectifier
文件页数: 1/11页
文件大小: 0K
描述: MOSFET N-CH 100V 33A TO-262
标准包装: 50
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 100V
电流 - 连续漏极(Id) @ 25° C: 33A
开态Rds(最大)@ Id, Vgs @ 25° C: 44 毫欧 @ 16A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 71nC @ 10V
输入电容 (Ciss) @ Vds: 1960pF @ 25V
功率 - 最大: 130W
安装类型: 通孔
封装/外壳: TO-262-3,长引线,I²Pak,TO-262AA
供应商设备封装: TO-262
包装: 管件
其它名称: *IRF540NL
PD - 91342B
IRF540NS
l
l
Advanced Process Technology
Ultra Low On-Resistance
IRF540NL
HEXFET ? Power MOSFET
l
l
l
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
D
V DSS = 100V
Description
Advanced HEXFET
Power MOSFETs from
l Fully Avalanche Rated
?
International Rectifier utilize advanced processing
techniques to achieve extremely low on-resistance per
silicon area. This benefit, combined with the fast
switching speed and ruggedized device design that
HEXFET power MOSFETs are well known for, provides
the designer with an extremely efficient and reliable
device for use in a wide variety of applications.
The D 2 Pak is a surface mount power package capable of
G
S
R DS(on) = 44m ?
I D = 33A
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D 2 Pak is suitable for high current applications because of
its low internal connection resistance and can dissipate up
to 2.0W in a typical surface mount application.
The through-hole version (IRF540NL) is available for low-
profile applications.
Absolute Maximum Ratings
Parameter
D 2 Pak
IRF540NS
Max.
TO-262
IRF540NL
Units
I D @ T C = 25°C
I D @ T C = 100°C
I DM
P D @T C = 25°C
V GS
I AR
E AR
dv/dt
Continuous Drain Current, V GS @ 10V ?
Continuous Drain Current, V GS @ 10V ?
Pulsed Drain Current ??
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Avalanche Current ?
Repetitive Avalanche Energy ?
Peak Diode Recovery dv/dt ??
33
23
110
130
0.87
± 20
16
13
7.0
A
W
W/°C
V
A
mJ
V/ns
T J
T STG
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
-55 to + 175
300 (1.6mm from case )
10 lbf?in (1.1N?m)
°C
Thermal Resistance
Parameter
Typ.
Max.
Units
R θ JC
R θ JA
Junction-to-Case
Junction-to-Ambient (PCB mount)**
–––
–––
1.15
40
°C/W
www.irf.com
1
07/01/05
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