参数资料
型号: IRF710STRLPBF
厂商: Vishay Siliconix
文件页数: 1/9页
文件大小: 0K
描述: MOSFET N-CH 400V 2.0A D2PAK
标准包装: 800
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 400V
电流 - 连续漏极(Id) @ 25° C: 2A
开态Rds(最大)@ Id, Vgs @ 25° C: 3.6 欧姆 @ 1.2A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 17nC @ 10V
输入电容 (Ciss) @ Vds: 170pF @ 25V
功率 - 最大: 3.1W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: D2PAK
包装: 带卷 (TR)
IRF710S, SiHF710S
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
FEATURES
? Halogen-free According to IEC 61249-2-21
V DS (V)
400
Definition
R DS(on) ( ? )
Q g (Max.) (nC)
Q gs (nC)
Q gd (nC)
Configuration
V GS = 10 V
17
3.4
8.5
Single
3.6
? Surface Mount
? Available in Tape and Reel
? Dynamic dV/dt Rating
? Repetitive Avalanche Rated
? Fast Switching
? Ease of Paralleling
? Simple Drive Requirements
D 2 PAK (TO-263)
D
? Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
G
ruggedized device design,
cost-effectiveness.
low on-resistance and
The D 2 PAK (TO-263) is a surface mount power package
G D
S
S
N-Channel MOSFET
capable of accommodating die size up to HEX-4. It provides
the highest power capability and the lowest possible
on-resistance in any existing surface mount package. The
D 2 PAK (TO-263) is suitable for high current applications
because of its low internal connection resistance and can
dissipate up to 2.0 W in a typical surface mount application.
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
D 2 PAK (TO-263)
SiHF710S-GE3
IRF710SPbF
SiHF710S-E3
D 2 PAK (TO-263)
SiHF710STRL-GE3 a
IRF710STRLPbF a
SiHF710STL-E3 a
D 2 PAK (TO-263)
-
IRF710STRRPbF a
SiHF710STR-E3 a
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS (T C = 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
SYMBOL
V DS
V GS
LIMIT
400
± 20
UNIT
V
Continuous Drain Current
V GS at 10 V
T C = 25 °C
T C = 100 °C
I D
2.0
1.2
A
Pulsed Drain Current a
I DM
6.0
Linear Derating Factor
Linear Derating Factor (PCB Mount) e
0.29
0.025
W/°C
Single Pulse Avalanche Energy b
Avalanche Current a
Repetitive Avalanche Energy a
Maximum Power Dissipation T C = 25 °C
Maximum Power Dissipation (PCB Mount) e T A = 25 °C
Peak Diode Recovery dV/dt c
E AS
I AR
E AR
P D
dV/dt
120
2.0
3.6
36
3.1
4.0
mJ
A
mJ
W
V/ns
Operating Junction and Storage Temperature Range T J , T stg
Soldering Recommendations (Peak Temperature) for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V DD = 50 V, starting T J = 25 °C, L = 52 mH, R g = 25 ? , I AS = 2.0 A (see fig. 12).
c. I SD ? 2.0 A, dI/dt ? 40 A/μs, V DD ? V DS , T J ? 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91042
S11-1048-Rev. C, 30-May-11
- 55 to + 150
300 d
°C
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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