参数资料
型号: IRLZ34NS
厂商: International Rectifier
文件页数: 2/11页
文件大小: 0K
描述: MOSFET N-CH 55V 30A D2PAK
标准包装: 50
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 55V
电流 - 连续漏极(Id) @ 25° C: 30A
开态Rds(最大)@ Id, Vgs @ 25° C: 35 毫欧 @ 16A,10V
Id 时的 Vgs(th)(最大): 2V @ 250µA
闸电荷(Qg) @ Vgs: 25nC @ 5V
输入电容 (Ciss) @ Vds: 880pF @ 25V
功率 - 最大: 3.8W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: D2PAK
包装: 管件
其它名称: *IRLZ34NS
IRLZ34NS/L
Electrical Characteristics @ T J = 25°C (unless otherwise specified)
Parameter
Min.
Typ.
Max. Units
Conditions
V (BR)DSS
Drain-to-Source Breakdown Voltage
55
–––
––– V V GS = 0V, I D = 250μA
? V (BR)DSS / ? T J Breakdown Voltage Temp. Coefficient
–––
–––
0.065
–––
––– V/°C Reference to 25°C, I D = 1mA ?
0.035 V GS = 10V, I D = 16A ?
R DS(on)
Static Drain-to-Source On-Resistance
–––
–––
0.046
?
V GS = 5.0V, I D = 16A ?
–––
–––
0.060 V GS = 4.0V, I D = 14A ?
––– I D = 16A
V GS(th)
g fs
I DSS
I GSS
Q g
Q gs
Q gd
t d(on)
t r
t d(off)
t f
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
1.0
11
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
8.9
100
21
29
2.0 V V DS = V GS , I D = 250μA
––– S V DS = 25V, I D = 16A ?
25 V DS = 55V, V GS = 0V
μA
250 V DS = 44V, V GS = 0V, T J = 150°C
100 V GS = 16V
nA
-100 V GS = -16V
25 I D = 16A
5.2 nC V DS = 44V
14 V GS = 5.0V, See Fig. 6 and 13 ??
––– V DD = 28V
ns
––– R G = 6.5 ?, V GS = 5.0V
––– R D = 1.8 ?, See Fig. 10 ??
L S
Internal Source Inductance
–––
7.5
–––
nH
Between lead,
and center of die contact
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
880 ––– V GS = 0V
220 ––– pF V DS = 25V
94 ––– ? = 1.0MHz, See Fig. 5 ?
Source-Drain Ratings and Characteristics
Parameter
Min. Typ. Max. Units
Conditions
I S
I SM
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) ?
––– –––
––– –––
30
110
A
MOSFET symbol
showing the
integral reverse
p-n junction diode.
G
D
S
V SD
t rr
Q rr
t on
Notes:
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
––– ––– 1.3 V T J = 25°C, I S = 16A, V GS = 0V ?
––– 76 110 ns T J = 25°C, I F = 16A
––– 190 290 nC di/dt = 100A/μs ??
Intrinsic turn-on time is negligible (turn-on is dominated by L S +L D )
? Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
? V DD = 25V, starting T J = 25°C, L =610μH
R G = 25 ? , I AS = 16A. (See Figure 12)
? I SD ≤ 16A, di/dt ≤ 270A/μs, V DD ≤ V (BR)DSS ,
T J ≤ 175°C
? Pulse width ≤ 300μs; duty cycle ≤ 2%.
? Uses IRLZ34N data and test conditions
** When mounted on 1" square PCB ( FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
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