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参数资料
| 型号： | IRM7001 |
| 厂商： | Vishay Intertechnology,Inc. |
| 英文描述： | SIR Modulator/Demodulator |
| 中文描述： | 爵士调制/解调器 |
| 文件页数： | 1/11页 |
| 文件大小： | 531K |
| 代理商： | IRM7001 |
Document Number: 82576
Revision 17-August-01
www.vishay.com
1
Figure 1. IRM7001 pin out
Figure 2. IRM7001 Block Diagram
IRM - 7001
1
2
3
4
5
6
7
8
9
TXD
RCV
A0
A1
A2
CLK_SEL
GND
V
CC
OSCIN
OSCOUT
PWR DN
PLS MOD
IR_TXD
IR_RCV
NRST
16XCLK
16
15
14
13
12
11
10
SIR
ENCODE
SIR
DECODE
TXD
IR_TXD
RCV
IR_RCV
A0
A1
A2
16XCLK
PULSEMOD
CLK_SEL
INT_CLOCK
CLOCK
DIVIDE
/NRST
IRM7001
SIR Modulator/Demodulator
FEATURES
Compliant with IrDA 1.0 Physical Layer Specifications
Interfaces with IrDA 1.0 Compliant IR Transceivers
Used in conjunction with Standard 16550 UART
Transmits/Receives either 1.6
Internal or External Clock Mode
Programmable Baud Rate
2.7–5.5 V Operation
16 Pin SOIC Package
μ
s or 3/16 Pulse Mode
APPLICATIONS
Interfaces with IR Transceivers in:
- Computer Applications:
PDAs
Dongle or other RS232 Adapter
- Telecom Application:
Modems
Fax Machines
Pagers
- Handheld Data Collection:
Industrial
Medical
Transportation
DESCRIPTION
The IRM7001 SIR-Encoder/Decoder is a CMOS modulator/
demodulator chip that is used to both encode and decode
information as per the IrDA SIR (Serial InfraRed) signal mod-
ulation and demodulation scheme. This chip is designed to
work with Infineon IrDA compatible transceivers and all other
IrDA compatible transceivers. The chip contains a clock
divider circuit used to generate the 16X clock internally. This
makes it very suitable for microcontroller-based embedded
system design.
.393 (10.0)
.386 (9.8)
.244 (6.2)
.229 (5.8)
R x 45
°
7
°
A
B
9
8
16
1
T
.157 (4.0)
.150 (3.8)
.009 (.25)
.008 (.19)
.016 (.40)
.049
(1.25)
.050
(1.27)
BSC
.014 (.35)
.019 (.49)
.004 (0.1)
.009 (.25)
.068 (1.75)
.054 (1.35)
Dimensions in inches (mm)
Notes:
1. Dimensions A and B are datums and T is a datum surface.
2. Dimensioning and tolerancing per ansi Y14.5M, 1982
3. Controlling dimension: millimeter.
4. Dimension A and B do not include mold protrusion.
5. Maximum mold protrusion 0.15 (0.005) per side.
SOIC Package
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