参数资料
型号: IRPLDIM3
厂商: International Rectifier
文件页数: 21/27页
文件大小: 0K
描述: KIT DES FLUOR BALLAST IRS2158D
标准包装: 1
主要目的: 照明,镇流器控制
嵌入式:
已用 IC / 零件: IRS2158D
主要属性: 28W TL5,可调光,PFC,灯开路、使用寿命结束和断电保护
次要属性: 点火预热
已供物品: 板,CD
相关产品: IRS2158DSPBF-ND - IC DVR HALF BRIDGE 600V 16-SOIC
IRS2158DPBF-ND - IC DVR HALF BRIDGE 600V 16-PDIP
IRS2158DSTRPBF-ND - IC BALLAST CTRL 600V 16-SOIC
The inductance must be sufficiently large to allow the PFC controller IC1 to maintain stable
operation when the line input at maximum and the dimming level is at minimum. Under these conditions
the COMP voltage at pin 2 will be very low and the PWM on time will be very short. If the inductor value
is too small the on time will become too small for the control IC to be able to maintain a stable DC bus.
The result of an unstable DC bus is a slight but visible flicker seen when the lamp is dimmed.
Such instability is usually caused by instability of the power factor correction section rather than the lamp
current regulation loop incorporated within the IRS2158D (IC2).
The trade off is that if the value of LPFC is too high the bus voltage will start to drop at low line
input and maximum load since the COMP pin voltage has reached maximum and therefore the maximum
on time limit has been reached. The lamp current control loop is however able to lower the ballast
frequency in order to compensate for this to some degree if necessary.
PCB Layout Considerations
In order to successfully utilize the IRS2158D in a ballast design, it is necessary to follow the
following PCB layout guidelines. This can avoid possible interference and ground loop issues that can
occur in the ballast circuit. These connection techniques also prevent high current ground loops from
interfering with sensitive timing component operation, and allows the entire control circuit to reject
common-mode noise due to output switching.
Figure 14 and Figure 15 show the control section of a typical ballast designed around the
IRS2158D, where the IC is located in the center. In this design all SMD devices are mounted under the
PCB with discrete devices on top.
Fig 14. Critical traces on the bottom side of the PCB
Fig 15. Critical traces on the top side of the PCB
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