参数资料
型号: IS61LPD25636A-200B3I
厂商: INTEGRATED SILICON SOLUTION INC
元件分类: SRAM
英文描述: 256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
中文描述: 256K X 36 CACHE SRAM, 3.1 ns, PBGA165
封装: 13 X 15 MM, 1 MM PITCH, PLASTIC, BGA-165
文件页数: 4/32页
文件大小: 311K
代理商: IS61LPD25636A-200B3I
12
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
12/13/06
IS61VPD25636A, IS61VPD51218A, IS61LPD25636A, IS61LPD51218A
ISSI
OPERATING RANGE (IS61LPDXXXXX)
Range
Ambient Temperature
VDD
VDDQ
Commercial
0°C to +70°C
3.3V + 5%
3.3 / 2.5V + 5%
Industrial
–40°C to +85°C
3.3V + 5%
3.3 / 2.5V + 5%
OPERATING RANGE (IS61VPDXXXXX)
Range
Ambient Temperature
VDD
VDDQ
Commercial
0°C to +70°C
2.5V + 5%
Industrial
–40°C to +85°C
2.5V + 5%
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
3.3V
2.5V
Symbol
Parameter
Test Conditions
Min.
Max.
Min.
Max.
Unit
VOH
Output HIGH Voltage
IOH = –4.0 mA (3.3V)
2.4
2.0
V
IOH = –1.0 mA (2.5V)
VOL
Output LOW Voltage
IOL = 8.0 mA (3.3V)
0.4
0.4
V
IOL = 1.0 mA (2.5V)
VIH
Input HIGH Voltage
2.0
VDD + 0.3
1.7
VDD + 0.3
V
VIL
Input LOW Voltage
-0.3
0.8
-0.3
0.7
V
ILI
Input Leakage Current
Vss
≤ VIN ≤ VDD(1)
-5
5
-5
5
A
ILO
Output Leakage Current Vss
≤ VOUT ≤ VDDQ,-5
5
-5
5
A
OE = VIH
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
-250
-200
MAX
Symbol Parameter
Test Conditions
Temp.range
x18
x36
x18
x36
Unit
ICC
AC Operating
Device Selected,
Com.
275
250
mA
Supply Current
OE = VIH, ZZ
≤ VIL,IND.
300
275
All Inputs
≤ 0.2V or ≥ VDD – 0.2V,
Cycle Time
≥ tKC min.
ISB
Standby Current
Device Deselected,
COM.
150
mA
TTL Input
VDD = Max.,
Ind.
150
All Inputs
≤ VIL or ≥ VIH,
ZZ
≤ VIL, f = Max.
ISBI
Standby Current
Device Deselected,
Com.
100
mA
CMOS Input
VDD = Max.,
Ind.
105
VIN
≤ VSS + 0.2V or ≥VDD – 0.2V
f = 0
ISB2
Sleep Mode
ZZ>VIH
Com.
50
mA
Ind.
60
Note:
1. MODE pin has an internal pullup and should be tied to VDD or VSS. It exhibits ±100A maximum leakage current when tied to
VSS + 0.2V or
≥ VDD – 0.2V.
相关PDF资料
PDF描述
IS61LPD25636A-200TQ 256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A-200TQ2I 256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A-200TQI 256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A-250B2 256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A 256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
相关代理商/技术参数
参数描述
IS61LPD25636A-200TQ 制造商:ISSI 制造商全称:Integrated Silicon Solution, Inc 功能描述:256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A-200TQ2I 制造商:ISSI 制造商全称:Integrated Silicon Solution, Inc 功能描述:256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A-200TQI 制造商:ISSI 制造商全称:Integrated Silicon Solution, Inc 功能描述:256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A-200TQLI 功能描述:静态随机存取存储器 8M (256Kx36) 200MHz Sync 静态随机存取存储器 3.3v RoHS:否 制造商:Cypress Semiconductor 存储容量:16 Mbit 组织:1 M x 16 访问时间:55 ns 电源电压-最大:3.6 V 电源电压-最小:2.2 V 最大工作电流:22 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:TSOP-48 封装:Tray
IS61LPD25636A-200TQLI-TR 功能描述:静态随机存取存储器 8M (256Kx36) 200MHz Sync 静态随机存取存储器 3.3v RoHS:否 制造商:Cypress Semiconductor 存储容量:16 Mbit 组织:1 M x 16 访问时间:55 ns 电源电压-最大:3.6 V 电源电压-最小:2.2 V 最大工作电流:22 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:TSOP-48 封装:Tray