参数资料
型号: ISL1801IVZ
厂商: Intersil
文件页数: 26/29页
文件大小: 0K
描述: IC CONV SOLAR PWR 48TSSOP
标准包装: 390
应用: 转换器,太阳能
输入电压: 9 V ~ 90 V
输出数: 4
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 48-TFSOP(0.240",6.10mm 宽)
供应商设备封装: 48-TSSOP
包装: 管件
ISL1801
Application Circuit 4, Buck-Boost Regulator with External Half Bridge Drivers
VIN+
VOUT+
PV
PANEL
ISL2110
HI HO
Half
Bridge
driver
Q1
Lo
Q3
ISL2110
HO HI
Half
Bridge
driver
Load
ISEN-
LI
LO
Q2
Q4
LO
LI
Rs
VIN-
ISEN+
ISEN-
1
2
3
NC1
NC2
VCC1
NC6
PGND1
NC5
48
47
46
4
5
AGND
OCSET3
VIN1
NC4
45
44
VIN+
6
7
NC3
PHASE3
PHASE1
BOOT1
43
42
VCC5V
VOUT1
10V
8
PGND3
TIMER
41
VOUT1
9
10
11
12
13
DRIVE3
PVCC3
BDRIVE
PGND4
PWM3
TON1
FB1
PRELOAD
GND
VCC5V
40
39
38
37
36
VIN2
PHASE2
PGND2
TON2
FB2
CMP2+
CMP2-
MCU
VOUT2
VOUT2
ISEN+
ISEN-
VOUT2
14
15
16
17
18
19
20
21
22
23
24
RPWM3
BCMD
BRESET
WDI
VDDREF
LATCHRPT
PGOOD2
AMPO
AMP-
AMP+
SGND
ISL1801
35
BOOT2 34
33
32
31
30
29
28
CMP1O 27
CMP1- 26
CMP1+ 25
VOUT2
3.3V
FIGURE 31. APPLICATION CIRCUIT 4
PC Board Layout Guidelines
Careful PC board layout is critical to achieve minimal switching
losses and clean, stable operation. This is especially true when
multiple converters are on the same PC board where one circuit
can affect the other. Refer to the ISL1801 Evaluation Board for a
specific layout example.
Mount all of the power components on the top side of the board
with their ground terminals flush against one another, if possible.
Follow these guidelines for good PC board layout:
? Isolate the power components on the top side from the
sensitive analog components on the bottom side with a ground
shield. Use a separate PGND plane under the V OUT1 and V OUT2
sections (called PGND1 and PGND2). Avoid the introduction of
AC currents into the PGND1 and PGND2 ground planes. Run
the power plane ground currents on the top side only, if
possible.
26
? Use a star ground connection on the power plane to minimize
the crosstalk between V OUT1 and V OUT2 .
? Keep the high-current paths short, especially at the ground
terminals. This practice is essential for stable, jitter-free
operation.
? Keep the power traces and load connections short. This practice
is essential for high efficiency. Using thick copper PC boards
(2oz vs 1oz) can enhance full-load efficiency by 1% or more.
Correctly routing PC board traces must be approached in terms
of fractions of centimeters, where a single mW of excess trace
resistance causes a measurable efficiency penalty.
? PHASE3 and GND connections to the synchronous rectifiers for
current limiting must be made using Kelvin-sense connections
to guarantee the current-limit accuracy. This is best done by
routing power to the MOSFETs from outside using the top
copper layer, while connecting PHASE traces inside
(underneath) the MOSFETs.
FN8259.0
June 29, 2012
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