参数资料
| 型号： | ISL55100AIRZ-T |
| 厂商： | Intersil |
| 文件页数： | 14/14页 |
| 文件大小： | 0K |
| 描述： | IC COMP DRVR/WINDOW 18V 72-QFN |
| 标准包装： | 1 |
| 系列： | * |
9
FN7486.2
November 24, 2008
Power Dissipation Considerations
Specifying continuous data rates, driver loads and driver
level amplitudes are key in determining power supply
requirements as well as dissipation/cooling necessities.
Driver Output patterns also impact these needs. The faster
the pin activity, the greater the need to supply current and
remove heat.
Frequency of Operation. These graphs are based on Driving
6.0/0.0V Out into a 1k
Ω Load. TjA for the device package is
23.0°C/W, 16.6°C/W and 14.9°C/W based on airflows of
0ms, 1ms and 2.5ms. The device is mounted per Note 1
under “Thermal Information” on page 4. With the high speed
data rate capability of the ISL55100A, it is possible to
exceed the +150°C “ absolute maximum junction
temperature” as operating conditions and frequencies
increase. Therefore, it is important to calculate the maximum
junction temperature for the application to determine if
operating conditions need to be modified for the device to
remain in the safe operating area.
The maximum power dissipation allowed in a package is
determined according to Equation 1:
where:
TJMAX = Maximum junction temperature
TAMAX = Maximum ambient temperature
θJA = Thermal resistance of the package
PDMAX = Maximum power dissipation in the package
The maximum power dissipation actually produced by an IC
is the total quiescent supply current times the total power
supply voltage, plus the power in the IC due to the loads.
Power also depends on number of channels changing state,
frequency of operation. The extent of continuous active
pattern generation/reception will greatly effect dissipation
requirements.
The power dissipation curves (Figure 17), provide a way to
see if the device will overheat. The maximum safe power
temperature vs operating frequency can be found
graphically in Figure 18. This graph is based on the package
type TJA ratings and actual current/wattage requirements of
the ISL55100A when driving a 1k load with a 6V High Level
and a 0V Low Rail. The temperatures are indicated as
calculated junction temperature over the ambient
temperature of the user’s system. Plots indicate temperature
change as operating frequency increases (the graph
assumes continuous operation). The user should evaluate
various heat sink/cooling options in order to control the
ambient temperature part of the equation. This is especially
true if the users applications require continuos, high speed
operation.
The reader is cautioned against assuming the same level of
thermal performance in actual applications. A careful
inspection of conditions in your application should be
conducted. Great care must be taken to ensure Die
Temperature does not exceed Absolute Maximum Thermal
Limits.
Important Note: The ISL55100A package metal plane is
used for heat sinking of the device. It is electrically
connected to the negative supply potential (VEE). If VEE is
tied to ground, the thermal pad can be connected to ground.
Otherwise, the thermal pad (VEE) must be isolated from
other power planes.
Power Supply Sequencing
The ISL55100A references every supply with respect to
VEE. Therefore apply VEE, then VCC followed by the VH, VL
busses, then the COMP High and Comp Low followed by the
CVA and CVB Supplies. Digital Inputs should be set with a
differential bias as soon as possible. In cases where VEXT is
being utilized (VEXT = VEE + 5.5V), it should be powered up
immediately after VCC. Basically, no pin should be biased
above VCC or below VEE.
Data Rates
contain two transitions within each period. A digital
application that requires a new test pattern every 50ns would
be running at a 20MHz Data Rate. Figure 19 reveals 100ns
period, in 10MHz frequency parlance, results in two 50ns
digital patterns.
ESD Protection
Figure 6 is the block diagram depicting the ESD protection
networks and the VOH upper FET body diode.
P
DMAX
T
JMAX - TAMAX
Θ
JA
---------------------------------------------
=
(EQ. 1)
ISL55100A
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL55100B | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Quad 18V Pin Electronics Driver/Window Comparator |
| ISL55100BEVAL3 | 功能描述:EVAL BOARD 3 FOR ISL55100B RoHS:否 类别:编程器，开发系统 >> 评估演示板和套件 系列:* 标准包装:1 系列:PSoC® 主要目的:电源管理，热管理 嵌入式:- 已用 IC / 零件:- 主要属性:- 次要属性:- 已供物品:板，CD，电源 |
| ISL55100BIRZ | 功能描述:IC COMP DRVR/WINDOW 18V 72-QFN RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ISL55100BIRZ-T | 功能描述:IC COMP DRVR/WINDOW 18V 72-QFN RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ISL55110 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Dual, High Speed MOSFET Driver |
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