参数资料
型号: ISL55100AIRZ-T
厂商: Intersil
文件页数: 6/14页
文件大小: 0K
描述: IC COMP DRVR/WINDOW 18V 72-QFN
标准包装: 1
系列: *
14
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN7486.2
November 24, 2008
ISL55100A
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
L72.10x10
72 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.80
0.90
1.00
-
A1
-
0.02
0.05
-
A2
-
0.65
1.00
9
A3
0.20 REF
9
b
0.18
0.25
0.30
5, 8
D
10.00 BSC
-
D1
9.75 BSC
9
D2
5.85
6.00
6.15
7, 8
E
10.00 BSC
-
E1
9.75 BSC
9
E2
5.85
6.00
6.15
7, 8
e
0.50 BSC
-
k0.20
-
L
0.30
0.40
0.50
8, 10
N72
2
Nd
18
3
Ne
18
3
P-
-
0.60
9
θ
--
12
9
Rev. 1 11/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land Pattern
Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P &
θ are present when
Anvil singulation method is used and not present for saw
singulation.
10. Compliant to JEDEC MO-220VNND-3 except for the "L" min
dimension.
相关PDF资料
PDF描述
ISL55100BIRZ IC COMP DRVR/WINDOW 18V 72-QFN
ISL5627INZ IC DAC DUAL 8BIT 3.3V 48-LQFP
ISL5629/2INZ IC DAC 8BIT CMOS DUAL 48LQFP
ISL5727INZ IC DAC DUAL 10BIT 3.3V 48-LQFP
ISL5729/2INZ IC DAC 10BIT CMOS DUAL 48LQFP
相关代理商/技术参数
参数描述
ISL55100B 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Quad 18V Pin Electronics Driver/Window Comparator
ISL55100BEVAL3 功能描述:EVAL BOARD 3 FOR ISL55100B RoHS:否 类别:编程器,开发系统 >> 评估演示板和套件 系列:* 标准包装:1 系列:PSoC® 主要目的:电源管理,热管理 嵌入式:- 已用 IC / 零件:- 主要属性:- 次要属性:- 已供物品:板,CD,电源
ISL55100BIRZ 功能描述:IC COMP DRVR/WINDOW 18V 72-QFN RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器,接收器,收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422,RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC(0.154",3.90mm 宽) 供应商设备封装:16-SOIC 包装:带卷 (TR)
ISL55100BIRZ-T 功能描述:IC COMP DRVR/WINDOW 18V 72-QFN RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器,接收器,收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422,RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC(0.154",3.90mm 宽) 供应商设备封装:16-SOIC 包装:带卷 (TR)
ISL55110 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Dual, High Speed MOSFET Driver