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参数资料
| 型号： | ISL59483IRZ-T13 |
| 厂商： | INTERSIL CORP |
| 元件分类： | 运动控制电子 |
| 英文描述： | Dual, 500MHz Triple, Multiplexing Amplifiers |
| 中文描述： | TRIPLE 2-CHANNEL, VIDEO MULTIPLEXER, PQCC48 |
| 封装： | 7 X 7 MM, ROHS COMPLIANT, PLASTIC, QFN-48 |
| 文件页数： | 11/17页 |
| 文件大小： | 909K |
| 代理商： | ISL59483IRZ-T13 |
11
FN6394.1
December 22, 2006
FIGURE 36. MUX 1: HIZ SWITCHING GLITCH V
IN
= 0V
FIGURE 37. MUX 2: HIZ SWITCHING GLITCH V
IN
= 0V
FIGURE 38. MUX 1: HIZ TRANSIENT RESPONSE V
IN
= 1V
FIGURE 39. MUX 2: HIZ TRANSIENT RESPONSE V
IN
= 1V
FIGURE 40. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FIGURE 41. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
Typical Performance Curves
V
S
= ±5V, R
L
= 500
Ω
to GND, T
A
= +25°C, unless otherwise specified.
(Continued)
1
2
10ns/DIV
0
0
V
IN
= 0V
V
OUT
A, B, C
HIZ
50
Ω
TERM.
1
2
20ns/DIV
0
0
V
IN
= 0V
V
OUT
A, B, C
HIZ
50
Ω
TERM.
V
IN
=1V
1
1
10ns/DIV
0
0
V
OUT
A, B, C
50
Ω
TERM.
HIZ
V
IN
= 1V
1
2
20ns/DIV
0
0
V
OUT
A, B, C
50
Ω
TERM.
HIZ
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
6
5
4
3
2
1
0
0
25
50
75
100
150
AMBIENT TEMPERATURE (°C)
P
4.34W
θ
JA
=+23°C/
QFN48
125
85
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
25
50
75
100
150
P
870mW
θ
JA
=+115°C/
QFN48
125
85
AMBIENT TEMPERATURE (°C)
ISL59483
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| ISL59530IKZ | 功能描述:IC CROSSPOINT SW 16X16 356PBGA RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:250 系列:- 功能:开关 电路:单刀单掷 导通状态电阻:48 欧姆 电压电源:单电源 电压 - 电源，单路/双路(±):2.7 V ~ 5.5 V 电流 - 电源:5µA 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:48-LQFP 供应商设备封装:48-LQFP（7x7） 包装:托盘 |
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