参数资料
| 型号： | ISL5961IBZ |
| 厂商： | Intersil |
| 文件页数： | 5/13页 |
| 文件大小： | 0K |
| 描述： | CONV D/A 14-BIT 3.3V 28-SOIC |
| 标准包装： | 26 |
| 位数： | 14 |
| 数据接口： | 并联 |
| 转换器数目： | 1 |
| 电压电源： | 模拟和数字 |
| 功率耗散（最大）： | 120mW |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 28-SOIC W |
| 包装： | 管件 |
| 输出数目和类型： | 2 电流，单极 |
| 采样率（每秒）： | 150M |
3-13
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
ISL5961
Thin Shrink Small Outline Plastic Packages (TSSOP)
α
INDEX
AREA
E1
D
N
12
3
-B-
0.10(0.004)
C A
M
BS
e
-A-
b
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
c
E
0.25(0.010)
B
M
L
0.25
0.010
GAUGE
PLANE
A2
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AE, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
0.05(0.002)
M28.173
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.047
-
1.20
-
A1
0.002
0.006
0.05
0.15
-
A2
0.031
0.051
0.80
1.05
-
b
0.0075
0.0118
0.19
0.30
9
c
0.0035
0.0079
0.09
0.20
-
D
0.378
0.386
9.60
9.80
3
E1
0.169
0.177
4.30
4.50
4
e
0.026 BSC
0.65 BSC
-
E
0.246
0.256
6.25
6.50
-
L
0.0177
0.0295
0.45
0.75
6
N28
28
7
α
0o
8o
0o
8o
-
Rev. 0 6/98
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相关代理商/技术参数 |
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| ISL59830 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:True Single Supply Video Driver |
| ISL59830_06 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:True Single Supply Video Driver |
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| ISL59830AIAZ | 功能描述:IC VIDEO DRIVER TRUE SGL 16-QSOP RoHS:是 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 应用:TFT-LCD 面板：VCOM 驱动器 输出类型:满摆幅 电路数:1 -3db带宽:35MHz 转换速率:40 V/µs 电流 - 电源:3.7mA 电流 - 输出 / 通道:1.3A 电压 - 电源，单路/双路(±):9 V ~ 20 V，±4.5 V ~ 10 V 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽）裸露焊盘 供应商设备封装:8-uMax-EP 包装:管件 |
| ISL59830AIAZ-T7 | 功能描述:IC VIDEO DRIVER TRUE SGL 16-QSOP RoHS:是 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 标准包装:1,000 系列:- 应用:驱动器 输出类型:差分 电路数:3 -3db带宽:350MHz 转换速率:1000 V/µs 电流 - 电源:14.5mA 电流 - 输出 / 通道:60mA 电压 - 电源，单路/双路(±):5 V ~ 12 V，±2.5 V ~ 6 V 安装类型:表面贴装 封装/外壳:20-VFQFN 裸露焊盘 供应商设备封装:20-QFN 裸露焊盘（4x4） 包装:带卷 (TR) |
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