参数资料
型号: ISL5961IBZ
厂商: Intersil
文件页数: 8/13页
文件大小: 0K
描述: CONV D/A 14-BIT 3.3V 28-SOIC
标准包装: 26
位数: 14
数据接口: 并联
转换器数目: 1
电压电源: 模拟和数字
功率耗散(最大): 120mW
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 28-SOIC(0.295",7.50mm 宽)
供应商设备封装: 28-SOIC W
包装: 管件
输出数目和类型: 2 电流,单极
采样率(每秒): 150M
4
Absolute Maximum Ratings
Thermal Information
Digital Supply Voltage DVDD to DCOM . . . . . . . . . . . . . . . . . . +3.6V
Analog Supply Voltage AVDD to ACOM. . . . . . . . . . . . . . . . . . +3.6V
Grounds, ACOM TO DCOM. . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V
Digital Input Voltages (D9-D0, CLK, SLEEP). . . . . . . . DVDD + 0.3V
Reference Input Voltage Range . . . . . . . . . . . . . . . . . . AVDD + 0.3V
Analog Output Current (IOUT) . . . . . . . . . . . . . . . . . . . . . . . . . 24mA
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Thermal Resistance (Typical, Note 1)
θJA(oC/W)
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
75
TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . .
110
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
AVDD = DVDD = +3.3V, VREF = Internal 1.2V, IOUTFS = 20mA, TA = 25
oC for All Typical Values
PARAMETER
TEST CONDITIONS
TA = -40
oC TO 85oC
UNITS
MIN
TYP
MAX
SYSTEM PERFORMANCE
Resolution
14
-
Bits
Integral Linearity Error, INL
“Best Fit” Straight Line (Note 7)
-5
±2.5
+5
LSB
Differential Linearity Error, DNL
(Note 7)
-3
±1.5
+3
LSB
Offset Error, IOS
IOUTA (Note 7)
-0.006
+0.006
% FSR
Offset Drift Coefficient
(Note 7)
-
0.1
-
ppm
FSR/oC
Full Scale Gain Error, FSE
With External Reference (Notes 2, 7)
-3
±0.5
+3
% FSR
With Internal Reference (Notes 2, 7)
-3
±0.5
+3
% FSR
Full Scale Gain Drift
With External Reference (Note 7)
-
±50
-
ppm
FSR/oC
With Internal Reference (Note 7)
-
±100
-
ppm
FSR/oC
Full Scale Output Current, IFS
2-
20
mA
Output Voltage Compliance Range
(Note 3)
-1.0
-
1.25
V
DYNAMIC CHARACTERISTICS
Maximum Clock Rate, fCLK
ISL5961/2IA, ISL5961/2IB
210
250
-
MHz
Maximum Clock Rate, fCLK
ISL5961IA, ISL5961IB
130
150
-
MHz
Output Rise Time
Full Scale Step
-
1.5
-
ns
Output Fall Time
Full Scale Step
-
1.5
-
ns
Output Capacitance
-10
-
pF
Output Noise
IOUTFS = 20mA
-
50
-
pA/
√Hz
IOUTFS = 2mA
-
30
-
pA/
√Hz
AC CHARACTERISTICS (Using Figure 13 with RDIFF = 50 and RLOAD= 50, Full Scale Output = -2.5dBm)
Spurious Free Dynamic Range,
SFDR Within a Window
fCLK = 210MSPS, fOUT = 80.8MHz, 30MHz Span (Notes 4, 7)
-
73
-
dBc
fCLK = 210MSPS, fOUT = 40.4MHz, 30MHz Span (Notes 4, 7)
-
82
-
dBc
fCLK = 130MSPS, fOUT = 20.2MHz, 20MHz Span (Notes 4, 7)
-
86
-
dBc
ISL5961
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