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参数资料
| 型号： | ISL6208CBZ-T |
| 厂商： | INTERSIL CORP |
| 元件分类： | MOSFETs |
| 英文描述： | High Voltage Synchronous Rectified Buck MOSFET Driver |
| 中文描述： | 4 A HALF BRDG BASED MOSFET DRIVER, PDSO8 |
| 封装： | ROHS COMPLIANT, PLASTIC, MS-012AA, SOIC-8 |
| 文件页数： | 5/11页 |
| 文件大小： | 1692K |
| 代理商： | ISL6208CBZ-T |
3
FN9115.3
August 7, 2008
ti
Absolute Maximum Ratings
Thermal Information
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltage (VFCCM, VPWM). . . . . . . . . . . . . -0.3V to VCC + 0.3V
BOOT Voltage (VBOOT-GND). . . . . . . . . . . . . . . . . . . . . -0.3V to 33V
BOOT To PHASE Voltage (VBOOT-PHASE) . . . . . . -0.3V to 7V (DC)
-0.3V to 9V (<10ns)
PHASE Voltage (Note 1) . . . . . . . . . . . . . . . . . . . GND - 0.3V to 30V
GND - 8V (<20ns Pulse Width, 10J)
UGATE Voltage . . . . . . . . . . . . . . . . VPHASE - 0.3V (DC) to VBOOT
VPHASE - 5V (<20ns Pulse Width, 10J) to VBOOT
LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V
GND - 2.5V (<20ns Pulse Width, 5J) to VCC + 0.3V
Ambient Temperature Range . . . . . . . . . . . . . . . . . .-40°C to +125°C
Recommended Operating Conditions
Ambient Temperature Range
. . . . . . . . . . . . . . . . . .-10°C to +100°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . +125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V
±10%
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
SOIC Package (Note 2) . . . . . . . . . . . .
110
N/A
QFN Package (Notes 3, 4). . . . . . . . . .
80
15
Maximum Storage Temperature Range . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. The Phase Voltage is capable of withstanding -7V when the BOOT pin is at GND.
2.
θ
JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
3.
θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
4. For
θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Recommended Operating Conditions, Unless Otherwise Noted. Parameters with MIN and/or MAX limits are
100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are
not production tested.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
VCC SUPPLY CURRENT
Bias Supply Current
IVCC
PWM pin floating, VFCCM = 5V
-
80
-
A
POR
VCC Rising
-
3.40
3.90
V
VCC Falling
2.40
2.90
-
V
Hysteresis
-
500
-
mV
BOOTSTRAP DIODE
Forward Voltage
VF
VVCC = 5V, forward bias current = 2mA
0.50
0.55
0.65
V
PWM INPUT
Input Current
IPWM
VPWM = 5V
-
250
-
A
VPWM = 0V
-
-250
-
A
PWM Three-State Rising Threshold
VVCC = 5V
0.70
1.00
1.30
V
PWM Three-State Falling Threshold
VVCC = 5V
3.5
3.8
4.1
V
Three-State Shutdown Hold-off Time
tTSSHD
VVCC = 5V, temperature = +25°C
100
175
250
ns
FCCM INPUT
FCCM LOW Threshold
0.50
-
V
FCCM HIGH Threshold
--
2.0
V
SWITCHING TIME
UGATE Rise Time (Note 5)
tRU
VVCC = 5V, 3nF load
-
8.0
-
ns
ISL6208
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