参数资料
| 型号： | ISL6263BHRZ-T |
| 厂商： | Intersil |
| 文件页数： | 17/18页 |
| 文件大小： | 0K |
| 描述： | IC DC/DC BUCK CTRLR 1PH 32-QFN |
| 标准包装： | 6,000 |
| 应用： | 转换器，Intel IMVP-6 |
| 输入电压： | 5 V ~ 25 V |
| 输出数： | 1 |
| 输出电压： | 0.41 V ~ 1.29 V |
| 工作温度： | -10°C ~ 100°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-VFQFN 裸露焊盘 |
| 供应商设备封装： | 32-QFN（5x5） |
| 包装： | 带卷 (TR) |
ISL6263B
LGATE, PVCC, and PGND
PGND is the return path for the pull-down of the LGATE
low-side MOSFET gate driver. Ideally, PGND should be
connected to the source of the low-side MOSFET with a
low-resistance, low-inductance path. The LGATE trace should
be routed in parallel with the trace from the PGND pin. These
two traces should be short, wide, and away from other traces
because of the high peak current and extremely fast dv/dt.
PVCC should be decoupled to PGND with a ceramic
capacitor physically located as close as practical to the IC
pins.
RBIAS
The resistor R RBIAS should be placed in close proximity to
the ISL6263B using a noise-free current return path to the
VSS pin.
IMON, SOFT, OCSET, V W, COMP, FB, VDIFF,
DROOP, DFB, VO, and VSUM
The traces and components associated with these pins
require close proximity to the IC as well as close proximity to
each other. This section of the converter circuit needs to be
located above the island of analog ground with the
single-point connection to the VSS pin.
VIAS TO
GROUND
PLANE
INDUCTOR
HIGH-SIDE
MOSFETS
GND
VOUT
PHASE
NODE
VIN
OUTPUT
CAPACITORS
SCHOTTKY
DIODE
LOW-SIDE
MOSFETS
INPUT
CAPACITORS
Resistor R S
Resistor R S is preferably located near the boundary
between the power ground and the island of analog ground
connected to the VSS pin.
VID<0:4>, AF_EN, PGOOD, and VR_ON
These are logic signals that do not require special attention.
FDE
FIGURE 13. TYPICAL POWER COMPONENT PLACEMENT
UGATE, BOOT, and PHASE
PHASE is the return path for the entire UGATE high-side
MOSFET gate driver. The layout for these signals require
similar treatment, but to a greater extent, than those for
LGATE, PVCC, and PGND. These signals swing from
approximately VIN to VSS and are more likely to couple into
other signals.
VSEN and RTN
These traces should be laid out as noise sensitive. For
optimum load line regulation performance, the traces
connecting these two pins to the Kelvin sense leads of the
processor should be laid out away from rapidly rising voltage
nodes, (switching nodes) and other noisy traces. The filter
capacitors C FILTER1 , C FILTER2 , and C FILTER3 used in
conjunction with filter resistors R FILTER1 and R FILTER2 form
common mode and differential mode filters as shown in
This logic signal should be treated as noise sensitive and
should be routed away from rapidly rising voltage nodes,
(switching nodes) and other noisy traces.
VIN
The VIN signal should be connected near the drain of the
high-side MOSFET.
Copper Size for the Phase Node
The parasitic capacitance and parasitic inductance of the
phase node should be kept very low to minimize ringing. It is
best to limit the size of the PHASE node copper in strict
accordance with the current and thermal management of the
application. An MLCC should be connected directly across
the drain of the high-side MOSFET and the source of the
low-side MOSFET to suppress turn-off voltage spikes.
Figure 8. The noise environment of the application and
actual board layout conditions will drive the extent of filter
complexity. The maximum recommended resistance for
R FILTER1 and R FILTER2 is approximately 10 Ω to avoid
interaction with the 50k Ω input resistance of the remote
sense differential amplifier. The physical location of these
resistors is not as critical as the filter capacitors. Typical
capacitance values for C FILTER1 , C FILTER2 , and C FILTER3
range between 330pF to 1000pF and should be placed near
the IC.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
17
FN6388.3
July 8, 2010
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相关代理商/技术参数 |
参数描述 |
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| ISL6263C | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:5-Bit VID Single-Phase Voltage Regulator with Current Monitor for GPU Core Power |
| ISL6263CEVAL1 | 功能描述:EVAL BOARD 1 FOR ISL6263C RoHS:否 类别:编程器，开发系统 >> 评估板 - 线性稳压器 (LDO) 系列:* 产品变化通告:1Q2012 Discontinuation 30/Mar/2012 设计资源:NCP590MNDPTAGEVB Gerber Files 标准包装:1 系列:- 每 IC 通道数:2 - 双 输出电压:1.8V，2.8V 电流 - 输出:300mA 输入电压:2.1 ~ 5.5 V 稳压器类型:正，固定式 工作温度:-40°C ~ 85°C 板类型:完全填充 已供物品:板 已用 IC / 零件:NCP590MNDP 其它名称:NCP590MNDPTAGEVB-NDNCP590MNDPTAGEVBOS |
| ISL6263CHRZ | 功能描述:直流/直流开关调节器 1-PHS INT DC/DC BUCK CNTRLR IMVP-6 W/IMON RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5 |
| ISL6263CHRZ-T | 功能描述:直流/直流开关调节器 1-PHS INT DC/DC BUCK CNTRLR IMVP-6 W/IMON RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5 |
| ISL6263CRZ | 功能描述:直流/直流开关调节器 1 PHS INT DC/DC BUCK CNTRLR FOR INTEL RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5 |
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