参数资料
| 型号： | ISL62771IRTZ-T |
| 厂商： | Intersil |
| 文件页数： | 32/36页 |
| 文件大小： | 0K |
| 描述： | IC PWM CTRLR MULTIPHASE 40TQFN |
| 标准包装： | 6,000 |
| 系列： | Robust Ripple Regulator™ (R³) |
| 应用： | 控制器，AMD Fusion? SVI 2.0 CPU GPU |
| 输入电压： | 4.5 V ~ 25 V |
| 输出数： | 2 |
| 输出电压： | 0.006 V ~ 1.55 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 40-WFQFN 裸露焊盘 |
| 供应商设备封装： | 40-TQFN-EP（5x5） |
| 包装： | 带卷 (TR) |
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ISL62771
When placing MOSFETs, try to keep the source of the upper
VIAS TO
GROUND
GND
OUTPUT
MOSFETs and the drain of the lower MOSFETs as close as
thermally possible (see Figure 31). Input high-frequency
PLANE
VOUT
CAPACITORS
SCHOTTKY
DIODE
capacitors should be placed close to the drain of the upper
MOSFETs and the source of the lower MOSFETs. Place the output
inductor and output capacitors between the MOSFETs and the
INDUCTOR
HIGH-SIDE
MOSFETS
PHASE
NODE
VIN
LOW-SIDE
MOSFETS
INPUT
CAPACITORS
load. High-frequency output decoupling capacitors (ceramic)
should be placed as close as possible to the decoupling target
(microprocessor), making use of the shortest connection paths to
any internal planes. Place the components in such a way that the
area under the IC has less noise traces with high dV/dt and di/dt,
FIGURE 31. TYPICAL POWER COMPONENT PLACEMENT
such as gate signals and phase node signals.
Table 14 shows layout considerations for the ISL62771
controller by pin.
TABLE 14. LAYOUT CONSIDERATIONS FOR THE ISL62771CONTROLLER
ISL62771 PIN
BOTTOM PAD
1
2
3
4
5
6
7
8
9
10
11
SYMBOL
GND
NTC_NB
IMON_NB
SVC
VR_HOT_L
SVD
VDDIO
SVT
ENABLE
PWROK
IMON
NTC
32
LAYOUT GUIDELINES
Connect this ground pad to the ground plane through a low impedance path. A minimum of 5 vias are
recommended to connect this pad to the internal ground plane layers of the PCB
The NTC thermistor must be placed close to the thermal source that is monitored to determine Northbridge
thermal throttling. Placement at the hottest spot of the Northbridge VR is recommended. Additional standard
resistors in the resistor network on this pin should be placed near the IC.
Place the IMON_NB resistor close to this pin and make keep a tight GND connection.
Use good signal integrity practices and follow AMD recommendations.
Follow AMD recommendations. Placement of the pull-up resistor near the IC is recommended.
Use good signal integrity practices and follow AMD recommendations.
Use good signal integrity practices and follow AMD recommendations.
Use good signal integrity practices and follow AMD recommendations.
Use good signal integrity practices.
Use good signal integrity practices and follow AMD recommendations.
Place the IMON resistor close to this pin and make keep a tight GND connection.
The NTC thermistor must be placed close to the thermal source that is monitored to determine Core thermal
throttling. Placement at the hottest spot of the Core VR is recommended. Additional standard resistors in the
resistor network on this pin should be placed near the IC.
FN8321.2
September 12, 2013
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL62773 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Multiphase PWM Regulator for AMD Fusiona?￠ Desktop CPUs Using SVI 2.0 |
| ISL62773HRZ | 功能描述:电流型 PWM 控制器 MULTI-OUTPUT CNTRLR FOR AMD FUSION UP RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
| ISL62773HRZ-T | 功能描述:电流型 PWM 控制器 MULTI-OUTPUT CNTRLR FOR AMD FUSION UP RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
| ISL62773IRZ | 功能描述:电流型 PWM 控制器 MULTI-OUTPUT CNTRLR FOR AMD FUSION UP RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
| ISL62773IRZ-T | 功能描述:电流型 PWM 控制器 MULTI-OUTPUT CNTRLR FOR AMD FUSION UP RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
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