参数资料
型号: ISL6406IV-T
厂商: Intersil
文件页数: 16/17页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM VM 16TSSOP
标准包装: 2,500
PWM 型: 电压模式
输出数: 1
频率 - 最大: 770kHz
占空比: 100%
电源电压: 2.97 V ~ 3.63 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 85°C
封装/外壳: 16-TSSOP(0.173",4.40mm 宽)
包装: 带卷 (TR)
ISL6406
Thin Shrink Small Outline Plastic Packages (TSSOP)
N
INDEX
AREA
E1
-B-
E
0.25(0.010) M
GAUGE
PLANE
B M
M16.173
16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
A - 0.043 - 1.10 -
1
2
3
L
A1
A2
0.002
0.033
0.006
0.037
0.05
0.85
0.15
0.95
-
-
0.05(0.002)
SEATING PLANE
0.25
0.010
b
0.0075
0.012
0.19
0.30
9
-A-
D
A
c
0.0035
0.008
0.09
0.20
-
D
0.193
0.201
4.90
5.10
3
e
b
-C-
A1
α
0.10(0.004)
A2
c
E1
e
E
L
0.169 0.177
0.026 BSC
0.246 0.256
0.020 0.028
4.30 4.50
0.65 BSC
6.25 6.50
0.50 0.70
4
-
-
6
0.10(0.004) M
C A M
B S
N
16
16
7
NOTES:
1. These package dimensions are within allowable dimensions of
α
0 o
8 o
0 o
8 o
-
Rev. 1 2/02
JEDEC MO-153-AB, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.15mm (0.006
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact. (Angles in degrees)
16
FN9073.8
September 4, 2009
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