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| 型号： | ISL6505CB |
| 厂商： | Intersil |
| 文件页数： | 13/17页 |
| 文件大小： | 0K |
| 描述： | IC MULTIPLE POWER CTRLR 20-SOIC |
| 标准包装： | 38 |
| 应用： | 电源控制器/监控器 |
| 电源电压： | 4.75 V ~ 5.25 V |
| 电流 - 电源： | 6mA |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 20-SOIC W |
| 包装： | 管件 |
ISL6505
Layout Considerations
The typical application employing an ISL6505 is a fairly
+12V IN
+5V SB
straight forward implementation. Like with any other linear
regulator, attention has to be paid to the few potentially
sensitive small signal components, such as those connected
C5VSB
5VSB
CIN
Q4
to sensitive nodes or those supplying critical bypass current.
SS
5VDLSB
The power components (pass transistors) and the
C HF1
CSS
5VDL
V OUT4
controller IC should be placed first. The controller should
be placed in a central position on the motherboard, closer
V OUT1
C BULK1
Q6
ISL6505
DR1
C BULK4
C HF4
to the memory controller chip and processor, but not
excessively far from the 3.3V DUAL island or the I/O
circuitry. Ensure the 1V2VID, 3V3, and 3V3DL connections
FB1
DLA
Q5
are properly sized to carry 100mA without exhibiting
significant resistive losses at the load end. Similarly, the
Q2
3V3DLSB
5V
+5V IN
input bias supply (5V SB ) can carry a significant level of
current - for best results, ensure it is connected to its
respective source through an adequately sized trace. The
pass transistors should be placed on pads capable of
heatsinking matching the device’s power dissipation.
V OUT3
C BULK3 C HF3
3V3DL
3V3
1V2VID
GND
C BULK2
V OUT2
C HF2
Where applicable, multiple via connections to a large
internal plane can significantly lower localized device
temperature rise.
Q3
+3.3V IN
Placement of the decoupling and bulk capacitors should follow
a placement reflecting their purpose. As such, the high-
frequency decoupling capacitors should be placed as close as
possible to the load they are decoupling; the ones decoupling
KEY
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT/POWER PLANE LAYER
VIA CONNECTION TO GROUND PLANE
t t
? V OUT = I OUT × ? ESR OUT + ---------------- ? , where
the controller close to the controller pins, the ones decoupling
the load close to the load connector or the load itself (if
embedded). Even though bulk capacitance (aluminum
electrolytics or tantalum capacitors) placement is not as
critical as the high-frequency capacitor placement, having
these capacitors close to the load they serve is preferable.
The critical small signal components include the soft-start
capacitor, C SS , as well as all the high-frequency decoupling
capacitors. Locate these components close to the respective
pins of the control IC, and connect them to ground through a
via placed close to the ground pad. Minimize any leakage
current paths from the SS node, as the internal current
source is only 10μA (typical).
A multi-layer printed circuit board is recommended.
Figure 12 shows the connections to most of the components
in the circuit. Note that the individual capacitors shown each
could represent numerous physical capacitors. Dedicate one
solid layer for a ground plane and make all critical
component ground connections through vias placed as close
to the component terminal as possible. Dedicate another
solid layer as a power plane and break this plane into smaller
islands of common voltage levels. Ideally, the power plane
should support both the input power and output power
nodes. Use copper filled polygons on the top and bottom
circuit layers to create power islands connecting the filtering
components (output capacitors) and the loads. Use the
remaining printed circuit layers for small signal wiring.
13
FIGURE 12. PRINTED CIRCUIT BOARD ISLANDS
Component Selection Guidelines
Output Capacitors Selection
The output capacitors should be selected to allow the output
voltage to meet the dynamic regulation requirements of
active state operation (S0, S1). The load transient for the
various microprocessor system’s components may require
high quality capacitors to supply the high slew rate (di/dt)
current demands. Thus, it is recommended that the output
capacitors be selected for transient load regulation, paying
attention to their parasitic components (ESR, ESL).
Also, during the transition between active and sleep states
on the 3.3V DUAL /3.3V SB and 5V DUAL outputs, there is a
short interval of time during which none of the power pass
elements are conducting - during this time the output
capacitors have to supply all the output current. The output
voltage drop during this brief period of time can be easily
approximated with the following formula:
? ?
? C OUT ?
? V OUT - output voltage drop
ESR OUT - output capacitor bank ESR
I OUT - output current during transition
C OUT - output capacitor bank capacitance
t t - active-to-sleep or sleep-to-active transition time (10 μ s typ.)
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相关代理商/技术参数 |
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| ISL6505CB-T | 功能描述:IC MULTIPLE POWER CTRLR 20-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 电源控制器，监视器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 应用:多相控制器 输入电压:- 电源电压:9 V ~ 14 V 电流 - 电源:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP（5x5） 包装:带卷 (TR) |
| ISL6505CR | 功能描述:IC MULTIPLE POWER CTRLR 20-QFN RoHS:否 类别:集成电路 (IC) >> PMIC - 电源控制器，监视器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 应用:多相控制器 输入电压:- 电源电压:9 V ~ 14 V 电流 - 电源:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP（5x5） 包装:带卷 (TR) |
| ISL6505CR-T | 功能描述:IC MULTIPLE POWER CTRLR 20-QFN RoHS:否 类别:集成电路 (IC) >> PMIC - 电源控制器，监视器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 应用:多相控制器 输入电压:- 电源电压:9 V ~ 14 V 电流 - 电源:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP（5x5） 包装:带卷 (TR) |
| ISL6505CRZ | 功能描述:IC PWR SUPPLY CTRLR/MONITR 20QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 电源控制器，监视器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 应用:多相控制器 输入电压:- 电源电压:9 V ~ 14 V 电流 - 电源:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP（5x5） 包装:带卷 (TR) |
| ISL6505CRZ-T | 功能描述:IC PWR SUPPLY CTRLR/MONITR 20QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 电源控制器，监视器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 应用:多相控制器 输入电压:- 电源电压:9 V ~ 14 V 电流 - 电源:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP（5x5） 包装:带卷 (TR) |
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