参数资料
型号: ISL6537CRZR5160
厂商: Intersil
文件页数: 11/15页
文件大小: 0K
描述: IC REG/CTRLR ACPI DUAL DDR 28QFN
标准包装: 50
应用: 存储器,DDR/DDR2 稳压器
电流 - 电源: 7mA
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 28-VQFN 裸露焊盘
供应商设备封装: 28-QFN(6x6)
包装: 管件
ISL6537
critical because they switch large amounts of energy, and
12V ATX
therefore tend to generate large amounts of noise. Next are
the small signal components which connect to sensitive
nodes or supply critical bypass current and signal coupling.
P12V
GNDP
C BP
5VDUAL
A multi-layer printed circuit board is recommended. Figure 2
shows the connections of the critical components in the
converter. Note that capacitors C IN and C OUT could each
5VSBY
ISL6537
5VSBY
C BP
C IN
represent numerous physical capacitors. Dedicate one solid
layer, usually a middle layer of the PC board, for a ground
UGATE
PHASE
Q 1
L 1
V DDQ
plane and make all critical component ground connections
with vias to this layer. Dedicate another solid layer as a
LGATE
Q 2
C OUT1
power plane and break this plane into smaller islands of
common voltage levels. Keep the metal runs from the
PHASE terminals to the output inductor short. The power
plane should support the input power and output power
nodes. Use copper filled polygons on the top and bottom
COMP
FB
C 2
R 2
R 4
C 1
R 1
C 3 R 3
circuit layers for the phase nodes. Use the remaining printed
circuit layers for small signal wiring. The wiring traces from
the GATE pins to the MOSFET gates should be kept short
VDDQ(2)
V DDQ
and wide enough to easily handle the 1A of drive current.
In order to dissipate heat generated by the internal V TT
LDO, the ground pad, pin 29, should be connected to the
internal ground plane through at least four vias. This allows
the heat to move away from the IC and also ties the pad to
the ground plane through a low impedance path.
VTT(2)
DRIVE4
C OUT2
V TT
Q 3
The switching components should be placed close to the
ISL6537 first. Minimize the length of the connections
between the input capacitors, C IN , and the power switches
FB4
C OUT3
by placing them nearby. Position both the ceramic and bulk
input capacitors as close to the upper MOSFET drain as
possible. Position the output inductor and output capacitors
between the upper and lower MOSFETs and the load.
DRIVE3
FB3
R 6
R 5
Q 4
C OUT4
V GMCH
The critical small signal components include any bypass
capacitors, feedback components, and compensation
REFADJ4
components. Place the PWM converter compensation
components close to the FB and COMP pins. The feedback
resistors should be located as close as possible to the FB
pin with vias tied straight to the ground plane as required.
Feedback Compensation - PWM Buck Converter
DRIVE2
FB2
R 8
R 7
Q 5
V TT_GMCH/CPU
C OUT4
Figure 3 highlights the voltage-mode control loop for a
synchronous-rectified buck converter. The output voltage
(V OUT ) is regulated to the Reference voltage level. The error
amplifier output (V E/A ) is compared with the oscillator (OSC)
triangular wave to provide a pulse-width modulated (PWM)
wave with an amplitude of V IN at the PHASE node. The
PWM wave is smoothed by the output filter (L O and C O ).
The modulator transfer function is the small-signal transfer
function of V OUT /V E/A . This function is dominated by a DC
Gain and the output filter (L O and C O ), with a double pole
break frequency at F LC and a zero at F ESR . The DC Gain of
the modulator is simply the input voltage (V IN ) divided by the
peak-to-peak oscillator voltage Δ V OSC .
11
GND PAD
KEY
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT AND/OR POWER PLANE LAYER
VIA CONNECTION TO GROUND PLANE
FIGURE 2. PRINTED CIRCUIT BOARD POWER PLANES
AND ISLANDS
FN9142.6
July 18, 2007
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