参数资料
| 型号： | ISL8101IRZ-T |
| 厂商： | Intersil |
| 文件页数： | 17/20页 |
| 文件大小： | 0K |
| 描述： | IC PWM CTRLR BUCK 2PHASE 24-QFN |
| 标准包装： | 6,000 |
| 应用： | 控制器，Intel VRM9，VRM10，AMD Hammer 应用 |
| 输入电压： | 4.6 V ~ 12 V |
| 输出数： | 1 |
| 输出电压： | 0.6 V ~ 2.3 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-VFQFN 裸露焊盘 |
| 供应商设备封装： | 24-QFN（4x4） |
| 包装： | 带卷 (TR) |
ISL8101
close to the device. It is especially important to locate the
components associated with the feedback circuit close to
their respective controller pins, since they belong to a high-
impedance circuit loop, sensitive to EMI pick-up. It is
important to place the R ISEN resistor close to the respective
terminal of the ISL8101.
A multi-layer printed circuit board is recommended. Figure 10
shows the connections of the critical components for one
output channel of the converter. Note that capacitors C xxIN
and C xxOUT could each represent numerous physical
capacitors. Dedicate one solid layer, usually the one
underneath the component side of the board, for a ground
plane and make all critical component ground connections
with vias to this layer. Dedicate another solid layer as a power
plane and break this plane into smaller islands of common
voltage levels. Keep the metal runs from the PHASE terminal
to inductor L OUT short. The power plane should support the
+12V IN
L IN
input power and output power nodes. Use copper filled
polygons on the top and bottom circuit layers for the phase
nodes. Use the remaining printed circuit layers for small signal
wiring. The wiring traces from the IC to the MOSFETs’ gates
and sources should be sized to carry at least one ampere of
current (0.02” to 0.05”).
+5V IN
(C F1 )
DACSEL/VID12
V CC
(C F2 )
P VCC
BOOT1
C BOOT1
(C HFIN1 )
C BIN1
VID4
VID3
VID2
VID1
VID0
VRM10
UGATE1
PHASE1
Q 1
Q 2
L OUT1
R ISEN
ISEN
LGATE1
BOOT2
V OUT
R’ OFS
SSEND
ENLL
ISL8101
C BOOT2
OFS
C BIN2
C BOUT
(C HFOUT )
R OFS
COMP
UGATE2
PHASE2
Q 3
(C HFIN2 )
C 2
R 2
C 1
LGATE2
Q 4
L OUT2
LOCATE NEAR LOAD;
(MINIMIZE CONNECTION PATH)
PGND
FB
R 1
LOCATE CLOSE TO IC
(MINIMIZE CONNECTION PATH)
GND
LOCATE NEAR SWITCHING TRANSISTORS;
(MINIMIZE CONNECTION PATH)
KEY
HEAVY TRACE ON CIRCUIT PLANE LAYER
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT PLANE LAYER
VIA CONNECTION TO GROUND PLANE
FIGURE 10. PRINTED CIRCUIT BOARD POWER PLANES AND ISLANDS
17
FN9223.1
July 28, 2008
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL8102 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Two-Phase Buck PWM Controller with High Current Integrated MOSFET Drivers |
| ISL8102CRZ | 功能描述:IC REG CTRLR BUCK PWM VM 32-QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:500kHz 占空比:100% 电源电压:8.2 V ~ 30 V 降压:无 升压:无 回扫:是 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:是 工作温度:0°C ~ 70°C 封装/外壳:8-DIP（0.300"，7.62mm） 包装:管件 产品目录页面:1316 (CN2011-ZH PDF) |
| ISL8102CRZ-T | 功能描述:IC REG CTRLR BUCK PWM VM 32-QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:4,000 系列:- PWM 型:电压模式 输出数:1 频率 - 最大:1.5MHz 占空比:66.7% 电源电压:4.75 V ~ 5.25 V 降压:是 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 85°C 封装/外壳:40-VFQFN 裸露焊盘 包装:带卷 (TR) |
| ISL8102EVAL1 | 功能描述:EVAL BOARD 1 FOR ISL8102 RoHS:否 类别:编程器，开发系统 >> 评估板 - DC/DC 与 AC/DC（离线）SMPS 系列:* 标准包装:1 系列:- 主要目的:DC/DC，步降 输出及类型:1，非隔离 功率 - 输出:- 输出电压:3.3V 电流 - 输出:3A 输入电压:4.5 V ~ 28 V 稳压器拓扑结构:降压 频率 - 开关:250kHz 板类型:完全填充 已供物品:板 已用 IC / 零件:L7981 其它名称:497-12113STEVAL-ISA094V1-ND |
| ISL8102IRZ | 功能描述:IC REG CTRLR BUCK PWM VM 32-QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:500kHz 占空比:100% 电源电压:8.2 V ~ 30 V 降压:无 升压:无 回扫:是 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:是 工作温度:0°C ~ 70°C 封装/外壳:8-DIP（0.300"，7.62mm） 包装:管件 产品目录页面:1316 (CN2011-ZH PDF) |
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