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参数资料
| 型号： | ISL8200MEVAL2PHZ |
| 厂商： | Intersil |
| 文件页数： | 19/23页 |
| 文件大小： | 0K |
| 描述： | EVAL BOARD FOR ISL8200M |
| 产品培训模块： | Solutions for Industrial Control Applications |
| 标准包装： | 1 |
| 系列： | * |
ISL8200M
3.5
3.0
12
10
2.5
2.0
1.5
1.0
0.8V
1.5V
3.3V
8
6
4
3.3V
1.5V
0.8V
0.5
2
0.0
0
2
4
6
8
10
0
60
70
80
90
100
110
LOAD CURRENT (A)
FIGURE 29. POWER LOSS vs LOAD CURRENT (5V IN )
5.0
12
AMBIENT TEMPERATURE (°C)
FIGURE 30. DERATING CURVE (5V IN )
4.5
4.0
5.0V
10
3.5
3.0
2.5
2.0
1.5
0.8V
1.5V
2.5V
3.3V
8
6
4
5.0V
3.3V
2.5V
1.5V
0.8V
1.0
0.5
2
0.0
0
2
4
6
8
10
0
60
70
80
90
100
110
LOAD CURRENT (A)
FIGURE 31. POWER LOSS vs LOAD CURRENT (12V IN )
Thermal Considerations
Experimental power loss curves along with θ JA from
thermal modeling analysis can be used to evaluate the
thermal consideration for the module. The derating
curves are derived from the maximum power allowed
while maintaining the temperature below the maximum
junction temperature of +125°C. In actual application,
other heat sources and design margin should be
considered.
Package Description
The structure of ISL8200M belongs to the Quad Flat-
pack No-lead package (QFN). This kind of package has
advantages, such as good thermal and electrical
conductivity, low weight and small size. The QFN
package is applicable for surface mounting technology
and is being more readily used in the industry. The
ISL8200M contains several types of devices, including
resistors, capacitors, inductors and control ICs. The
ISL8200M is a copper lead-frame based package with
exposed copper thermal pads, which have good
electrical and thermal conductivity. The copper lead
frame and multi component assembly is overmolded
with polymer mold compound to protect these devices.
19
AMBIENT TEMPERATURE (°C)
FIGURE 32. DERATING CURVE (12V IN )
The package outline and typical PCB layout pattern
design and typical stencil pattern design are shown in the
package outline drawing L23.15x15 on page 22. The
module has a small size of 15mm x 15mm x 2.2mm.
Figure 33 shows typical reflow profile parameters. These
guidelines are general design rules. Users could modify
parameters according to their application.
PCB Layout Pattern Design
The bottom of ISL8200M is a lead-frame footprint, which
is attached to the PCB by surface mounting process. The
PCB layout pattern is shown in the Package Outline
Drawing L23.15x15 on page 22. The PCB layout pattern
is essentially 1:1 with the QFN exposed pad and I/O
termination dimensions, except for the PCB lands being a
slightly extended distance of 0.2mm (0.4mm max)
longer than the QFN terminations, which allows for solder
filleting around the periphery of the package. This
ensures a more complete and inspectable solder joint.
The thermal lands on the PCB layout should match 1:1
with the package exposed die pads.
FN6727.1
February 26, 2010
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL8200MIRZ | 功能描述:DC/DC转换器 STAND ALONE 10A DC/D CSTEPDWNPWRSUPPYMOD1 RoHS:否 制造商:Murata 产品: 输出功率: 输入电压范围:3.6 V to 5.5 V 输入电压（标称）: 输出端数量:1 输出电压（通道 1）:3.3 V 输出电流（通道 1）:600 mA 输出电压（通道 2）: 输出电流（通道 2）: 安装风格:SMD/SMT 封装 / 箱体尺寸: |
| ISL8200MIRZ-T | 功能描述:DC/DC转换器 ST& ALONE 10A DC/DC DWN PWR SUPPLY MOD RoHS:否 制造商:Murata 产品: 输出功率: 输入电压范围:3.6 V to 5.5 V 输入电压（标称）: 输出端数量:1 输出电压（通道 1）:3.3 V 输出电流（通道 1）:600 mA 输出电压（通道 2）: 输出电流（通道 2）: 安装风格:SMD/SMT 封装 / 箱体尺寸: |
| ISL8200MIRZ-TR5545 | 制造商:Intersil Corporation 功能描述:STAND ALONE 10A DC/DC STEP DOWN POWER SUPPLY MODULE, 15 X 15 - Tape and Reel |
| ISL8200MMREP | 制造商:Intersil Corporation 功能描述:V62/10608-01XB, STAND ALONE 10A DC/DC STEP DOWN POWER SUPPLY - Trays |
| ISL8200MMREP-T | 制造商:Intersil Corporation 功能描述:V62/10608-01XB, STAND ALONE 10A DC/DC STEP DOWN POWER SUPPLY - Tape and Reel |
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